Inventor

YIM MYUNG JIN

US28 patents

⚠️ This page may combine multiple inventors who share the name “YIM MYUNG JIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YIM MYUNG JIN

INTEL CORP

Co-packaging with silicon photonics hybrid planar lightwave circuit

Semiconductor package with embedded optical die

Semiconductor package with embedded optical die

Optoelectronic device module having a silicon interposer

Integrated circuit with chip-on-chip and chip-on-substrate configuration

Optoelectronic packaging assemblies

Semiconductor package with embedded optical die

In-package photonics integration and assembly architecture

Co-packaging with silicon photonics hybrid planar lightwave circuit

Dynamic beam steering optoelectronic packages

Method of fabricating an optical module that includes an electronic package

KOREA ADVANCED INST SCI & TECH

Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate

High adhesion triple layered anisotropic conductive adhesive film

Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method

Method for fabricating wafer-level flip chip package using pre-coated anisotropic conductive adhesive

CMOS image sensor module with wafers

Method for manufacturing conductive adhesive for high frequency flip chip package applications

MICRON TECHNOLOGY INC

Molding compound including a carbon nano-tube dispersion

Forming a carbon nano-tube dispersion

Package including an underfill material in a portion of an area between the package and a substrate or another package

Multi-die building block for stacked-die package

YIM MYUNG JIN

Methods for fabricating integrated circuit systems including high reliability die under-fill

Molding compound including a carbon nano-tube dispersion

Package including an underfill material in a portion of an area between the package and a substrate or another package

TELEPHUS INC

Multilayered anisotropic conductive adhesive for fine pitch

High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same

GLOBALFOUNDRIES INC

Method for fabricating through substrate vias in semiconductor substrate

ZHANG JAMES JIAN

Package including at least one topological feature on an encapsulant material to resist out-of-plane deformation