Inventor

Lin kevin l

US44 patents

⚠️ This page may combine multiple inventors who share the name “Lin kevin l”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

Lin kevin l

INTEL CORP

Advanced lithography and self-assembled devices

Adjustment of monitor resolution and pixel refreshment based on detected viewer distance

Advanced lithography and self-assembled devices

Advanced lithography and self-assembled devices

Advanced lithography and self-assembled devices

Integrated circuit components with substrate cavities

Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefrom

Self-aligned via

Lined photobucket structure for back end of line (BEOL) interconnect formation

Single mask lithography line end enhancement

Rendering techniques for textured displays

Integrated circuit components with dummy structures

Metal oxycarbide resists as leave behind plugs

Multi-height and multi-width interconnect line metallization for integrated circuit structures

Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefrom

Differential hardmasks for modulation of electrobucket sensitivity

Device including air gapping of gate spacers and other dielectrics and process for providing such

Peripheral inductors

Local interconnect with air gap

Differential hardmasks for modulation of electrobucket sensitivity

Photobucket floor colors with selective grafting

Differentiated molecular domains for selective hardmask fabrication and structures resulting therefrom

Self-aligned via below subtractively patterned interconnect

Vertically spaced intra-level interconnect line metallization for integrated circuit devices

Lined photobucket structure for back end of line (BEOL) interconnect formation

Vertically spaced intra-level interconnect line metallization for integrated circuit devices

Hardened plug for improved shorting margin

Metal spacers with hard masks formed using a subtractive process

Magnetic memory device with ruthenium diffusion barrier

Inductor/core assemblies for integrated circuits

Spacer-based patterning for tight-pitch and low-variability random access memory (RAM) bit cells and the resulting structures

Integrated circuit components with dummy structures

Integrated thermoelectric device to mitigate integrated circuit hot spots

Selectable vias for back end of line interconnects

Configurable resistor

Surface-aligned lithographic patterning approaches for back end of line (BEOL) interconnect fabrication

Semiconductor package with air pressure sensor

Method of creating a maskless air gap in back end interconnections with double self-aligned vias

Integrated circuit structure with filled recesses

Nitrogen assisted oxide gapfill

Lin kevin l

Semiconductor package with air pressure sensor

Method, apparatus and system for providing metering of acceleration

TEH WENG HONG

Semiconductor package with mechanical fuse

CHANDHOK MANISH

Method of creating a maskless air gap in back end interconnects with double self-aligned vias