Inventor

TUNG SZU-PING

TW37 patents

⚠️ This page may combine multiple inventors who share the name “TUNG SZU-PING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TUNG SZU-PING

TAIWAN SEMICONDUCTOR MFG CO LTD

Method of forming an interconnect structure having an air gap and structure thereof

Etch stop layer for semiconductor devices

Metal-based etch-stop layer

Semiconductor devices and methods of forming same

Method of forming an interconnect structure having an air gap and structure thereof

Via structure, MRAM device using the via structure and method for fabricating the MRAM device

Etch stop layer for semiconductor devices

Etch stop layer for semiconductor devices

Metal-based etch-stop layer

Semiconductor devices and methods of forming same

Method of forming an interconnect structure having an air gap and structure thereof

Self-aligned repairing process for barrier layer

Method for integrated circuit patterning

Selective repairing process for barrier layer

Patterning material including silicon-containing layer and method for semiconductor device fabrication

Memory device and method for fabricating the same

Memory device

Thin-film non-uniform stress evaluation

Etch stop layer for semiconductor devices

Patterning material including silicon-containing layer and method for semiconductor device fabrication

Method of forming an interconnect structure having an air gap and structure thereof

Memory device and method for fabricating the same

Metal-based etch-stop layer

Method of forming an interconnect structure having an air gap and structure thereof

Patterning method for semiconductor devices and structures resulting therefrom

Method of manufacturing a semiconductor device and a semiconductor device

Method for evaluating non-uniform stress

Method of forming an interconnect structure having an air gap and structure thereof

Metal capping process and processing platform thereof

Structure and method for forming interconnect structure

Metal capping process and processing platform thereof

Film deposition for patterning process

TAIWAN SEMICONDUCTOR MFG

Structure and method for forming interconnect structure

Method for integrated circuit patterning

Self-aligned repairing process for barrier layer

Hard mask edge cover scheme

Interconnect structures and methods of forming same