Inventor
CHEN HUI-LING
TW39 patents
⚠️ This page may combine multiple inventors who share the name “CHEN HUI-LING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
17 patentsUS7387950B1Jun 17, 2008
Method for forming a metal structure
UNITED MICROELECTRONICS CORP31 citations92
US11450633B2Sep 20, 2022
Package structure of semiconductor device with improved bonding between the substrates
UNITED MICROELECTRONICS CORP6 citations74
US11164822B1Nov 2, 2021
Structure of semiconductor device and method for bonding two substrates
UNITED MICROELECTRONICS CORP3 citations72
US11631771B2Apr 18, 2023
Oxide semiconductor field effect transistor
UNITED MICROELECTRONICS CORP1 citations71
US11088285B2Aug 10, 2021
Oxide semiconductor field effect transistor and forming method thereof
UNITED MICROELECTRONICS CORP3 citations71
US10446689B1Oct 15, 2019
Manufacturing method of oxide semiconductor device
UNITED MICROELECTRONICS CORP4 citations71
US7649268B2Jan 19, 2010
Semiconductor wafer
UNITED MICROELECTRONICS CORP4 citations62
US12027629B2Jul 2, 2024
Oxide semiconductor field effect transistor
UNITED MICROELECTRONICS CORP0 citations60
US11355431B2Jun 7, 2022
Semiconductor structure
UNITED MICROELECTRONICS CORP1 citations60
US11342465B2May 24, 2022
Method of forming oxide semiconductor field effect transistor
UNITED MICROELECTRONICS CORP0 citations60
US12148723B2Nov 19, 2024
Structure of semiconductor device
UNITED MICROELECTRONICS CORP0 citations58
US11557558B2Jan 17, 2023
Structure of semiconductor device and method for bonding two substrates
UNITED MICROELECTRONICS CORP0 citations58
US9048246B2Jun 2, 2015
Die seal ring and method of forming the same
UNITED MICROELECTRONICS CORP1 citations51
US7696606B2Apr 13, 2010
Metal structure
UNITED MICROELECTRONICS CORP0 citations51
US12272662B2Apr 8, 2025
Semiconductor structure
UNITED MICROELECTRONICS CORP0 citations50
US11869854B2Jan 9, 2024
Semiconductor structure formed with inductance elements
UNITED MICROELECTRONICS CORP0 citations50
US10446688B1Oct 15, 2019
Oxide semiconductor device and manufacturing method thereof
UNITED MICROELECTRONICS CORP0 citations50
CHI MEI COMM SYSTEMS INC
4 patentsIND TECH RES INST
4 patentsUS11676682B1Jun 13, 2023
Methods for accurate sequence data and modified base position determination
IND TECH RES INST0 citations62
US9767251B2Sep 19, 2017
Methods for accurate sequence data and modified base position determination
IND TECH RES INST1 citations62
US9747414B2Aug 29, 2017
Methods for accurate sequence data and modified base position determination
IND TECH RES INST1 citations62
US10515714B2Dec 24, 2019
Methods for accurate sequence data and modified base position determination
IND TECH RES INST0 citations51