Inventor
LIN HUNG CHENG
TW25 patents
⚠️ This page may combine multiple inventors who share the name “LIN HUNG CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
9 patentsUS11916132B2Feb 27, 2024
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11710782B2Jul 25, 2023
Post-formation mends of dielectric features
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11437492B2Sep 6, 2022
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11316034B2Apr 26, 2022
Post-formation mends of dielectric features
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12288814B2Apr 29, 2025
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12206013B2Jan 21, 2025
Post-formation mends of dielectric features
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12176349B2Dec 24, 2024
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11764221B2Sep 19, 2023
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12495568B2Dec 9, 2025
Dummy Fin structures and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
TEKCORE CO LTD
4 patentsUS7598105B2Oct 6, 2009
Light emitting diode structure and method for fabricating the same
TEKCORE CO LTD22 citations92
US7713769B2May 11, 2010
Method for fabricating light emitting diode structure having irregular serrations
TEKCORE CO LTD10 citations84
US7799593B2Sep 21, 2010
Light emitting diode structure and method for fabricating the same
TEKCORE CO LTD2 citations62
US7645624B2Jan 12, 2010
Method for self bonding epitaxy
TEKCORE CO LTD0 citations50