Inventor
KONKOLA PAUL
US24 patents
⚠️ This page may combine multiple inventors who share the name “KONKOLA PAUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
22 patentsUS10121689B2Nov 6, 2018
Moment cancelling pad raising mechanism in wafer positioning pedestal for semiconductor processing
LAM RES CORP43 citations98
US9960068B1May 1, 2018
Moment cancelling pad raising mechanism in wafer positioning pedestal for semiconductor processing
LAM RES CORP26 citations94
US9892956B1Feb 13, 2018
Wafer positioning pedestal for semiconductor processing
LAM RES CORP28 citations94
US11056380B2Jul 6, 2021
Wafer positioning pedestal for semiconductor processing
LAM RES CORP4 citations84
US10870922B2Dec 22, 2020
Moment cancelling pad raising mechanism in wafer positioning pedestal for semiconductor processing
LAM RES CORP6 citations84
US10699937B2Jun 30, 2020
Wafer positioning pedestal for semiconductor processing
LAM RES CORP8 citations84
US10354909B2Jul 16, 2019
Wafer positioning pedestal for semiconductor processing
LAM RES CORP5 citations84
US10020220B2Jul 10, 2018
Wafer positioning pedestal for semiconductor processing
LAM RES CORP9 citations84
US11984298B2May 14, 2024
Impedance transformation in radio-frequency-assisted plasma generation
LAM RES CORP5 citations83
US10651065B2May 12, 2020
Auto-calibration to a station of a process module that spins a wafer
LAM RES CORP6 citations82
US11387136B2Jul 12, 2022
Pad raising mechanism in wafer positioning pedestal for semiconductor processing
LAM RES CORP3 citations73
US10570515B2Feb 25, 2020
Moment cancelling pad raising mechanism in wafer positioning pedestal for semiconductor processing
LAM RES CORP3 citations73
US10573549B2Feb 25, 2020
Pad raising mechanism in wafer positioning pedestal for semiconductor processing
LAM RES CORP3 citations73
US10622243B2Apr 14, 2020
Planar substrate edge contact with open volume equalization pathways and side containment
LAM RES CORP2 citations72
US11955366B2Apr 9, 2024
Pad raising mechanism in wafer positioning pedestal for semiconductor processing
LAM RES CORP0 citations62
US11443975B2Sep 13, 2022
Planar substrate edge contact with open volume equalization pathways and side containment
LAM RES CORP0 citations62
US12394601B2Aug 19, 2025
Impedance transformation in radio-frequency-assisted plasma generation
LAM RES CORP1 citations61
US12489006B2Dec 2, 2025
Auto-calibration to a station of a process module that spins a wafer
LAM RES CORP0 citations60
US11742229B2Aug 29, 2023
Auto-calibration to a station of a process module that spins a wafer
LAM RES CORP0 citations60
US11239100B2Feb 1, 2022
Auto-calibration to a station of a process module that spins a wafer
LAM RES CORP0 citations60
US12266509B2Apr 1, 2025
Multilayer coatings of component parts for a work piece processing chamber
LAM RES CORP0 citations57
US12186851B2Jan 7, 2025
Use of vacuum during transfer of substrates
LAM RES CORP0 citations51