Inventor
BUTT SHELDON H
US50 patents
⚠️ This page may combine multiple inventors who share the name “BUTT SHELDON H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
OLIN CORP
49 patentsUS5014159AMay 7, 1991
Semiconductor package
OLIN CORP137 citations98
US4888449ADec 19, 1989
Semiconductor package
OLIN CORP152 citations98
US4961106AOct 2, 1990
Metal packages having improved thermal dissipation
OLIN CORP59 citations96
US4882212ANov 21, 1989
Electronic packaging of components incorporating a ceramic-glass-metal composite
OLIN CORP114 citations96
US4866571ASep 12, 1989
Semiconductor package
OLIN CORP92 citations96
US4839716AJun 13, 1989
Semiconductor packaging
OLIN CORP69 citations96
US4784974ANov 15, 1988
Method of making a hermetically sealed semiconductor casing
OLIN CORP58 citations96
US4769345ASep 6, 1988
Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor
OLIN CORP107 citations96
US4656499AApr 7, 1987
Hermetically sealed semiconductor casing
OLIN CORP68 citations96
US4607276AAug 19, 1986
Tape packages
OLIN CORP75 citations96
US4594770AJun 17, 1986
Method of making semiconductor casing
OLIN CORP59 citations96
US4542259ASep 17, 1985
High density packages
OLIN CORP57 citations96
US4524238AJun 18, 1985
Semiconductor packages
OLIN CORP69 citations96
US4491622AJan 1, 1985
Composites of glass-ceramic to metal seals and method of making the same
OLIN CORP73 citations96
US4480262AOct 30, 1984
Semiconductor casing
OLIN CORP69 citations96
US4461924AJul 24, 1984
Semiconductor casing
OLIN CORP61 citations96
US4410927AOct 18, 1983
Casing for an electrical component having improved strength and heat transfer characteristics
OLIN CORP83 citations96
US4897508AJan 30, 1990
Metal electronic package
OLIN CORP121 citations95
US4849857AJul 18, 1989
Heat dissipating interconnect tape for use in tape automated bonding
OLIN CORP95 citations94
US5001546AMar 19, 1991
Clad metal lead frame substrates
OLIN CORP46 citations93
US4851615AJul 25, 1989
Printed circuit board
OLIN CORP29 citations93
US4736236AApr 5, 1988
Tape bonding material and structure for electronic circuit fabrication
OLIN CORP34 citations93
US4682414AJul 28, 1987
Multi-layer circuitry
OLIN CORP31 citations93
US4577056AMar 18, 1986
Hermetically sealed metal package
OLIN CORP53 citations93
US4569692AFeb 11, 1986
Low thermal expansivity and high thermal conductivity substrate
OLIN CORP46 citations93
US4532222AJul 30, 1985
Reinforced glass composites
OLIN CORP27 citations93
US5024883AJun 18, 1991
Electronic packaging of components incorporating a ceramic-glass-metal composite
OLIN CORP47 citations92
US4805009AFeb 14, 1989
Hermetically sealed semiconductor package
OLIN CORP48 citations92
US4796083AJan 3, 1989
Semiconductor casing
OLIN CORP27 citations92
US4767049AAug 30, 1988
Special surfaces for wire bonding
OLIN CORP31 citations92
US4761518AAug 2, 1988
Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs
OLIN CORP85 citations91
US4525422AJun 25, 1985
Adhesion primers for encapsulating epoxies
OLIN CORP28 citations91
US4521469AJun 4, 1985
Casing for electronic components
OLIN CORP37 citations91
US4862323AAug 29, 1989
Chip carrier
OLIN CORP23 citations82
US4659404AApr 21, 1987
Method of making low thermal expansivity and high thermal conductivity substrate
OLIN CORP19 citations82
US4570337AFeb 18, 1986
Method of assembling a chip carrier
OLIN CORP24 citations82
US3944504AMar 16, 1976
Catalyst for the diminution of automobile exhaust gases
OLIN CORP32 citations82
US4582556AApr 15, 1986
Adhesion primers for encapsulating epoxies
OLIN CORP22 citations81
US4889960ADec 26, 1989
Sealed semiconductor casing
OLIN CORP11 citations74
US4882236ANov 21, 1989
Rigid magnetic recording disks and method of producing same
OLIN CORP12 citations74
US4853491AAug 1, 1989
Chip carrier
OLIN CORP9 citations74
US4827377AMay 2, 1989
Multi-layer circuitry
OLIN CORP17 citations74
US4652323AMar 24, 1987
Plasma deposition applications for communication cables
OLIN CORP18 citations74
US4275784AJun 30, 1981
Fail safe heat exchanger
OLIN CORP7 citations74
US4099559AJul 11, 1978
Solar absorber plate design
OLIN CORP14 citations74
US4883778ANov 28, 1989
Products formed of a ceramic-glass-metal composite
OLIN CORP13 citations73
USD265584SJul 27, 1982
Three tube heat exchanger panel
OLIN CORP7 citations73
US4246960AJan 27, 1981
Fail safe heat exchanger
OLIN CORP5 citations63
US3931049AJan 6, 1976
Method for producing a catalyst
OLIN CORP5 citations63