Inventor
NAITOH SHIGEKI
JP16 patents
⚠️ This page may combine multiple inventors who share the name “NAITOH SHIGEKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUMITOMO CHEMICAL CO
15 patentsUS5399715AMar 21, 1995
Polyamino oligomers and polymaleimide compounds
SUMITOMO CHEMICAL CO31 citations92
US5478871ADec 26, 1995
Polyhydric phenol from naphthaldehyde and epoxy resin obtained using the same
SUMITOMO CHEMICAL CO27 citations91
US7423083B2Sep 9, 2008
Photosemiconductor encapsulant of epoxy group-containing (meth) acrylic polymer and alicyclic anhydride
SUMITOMO CHEMICAL CO9 citations80
US5939509AAug 17, 1999
Epoxy resin, resin composition, and resin-encapsulated semiconductor device
SUMITOMO CHEMICAL CO5 citations73
US5939473AAug 17, 1999
Epoxy resin, resin composition, and resin-encapsulated semiconductor device
SUMITOMO CHEMICAL CO6 citations73
US5252687AOct 12, 1993
Thermosetting resin composition and use thereof for an electronic part
SUMITOMO CHEMICAL CO18 citations73
US5109087AApr 28, 1992
Aromatic allyl amine thermosetting resin composition
SUMITOMO CHEMICAL CO5 citations73
US5395912AMar 7, 1995
Polyhydric phenol and epoxy resin and epoxy resin composition derived therefrom
SUMITOMO CHEMICAL CO1 citations62
US5329047AJul 12, 1994
Aromatic allyl amine thermosetting resin composition
SUMITOMO CHEMICAL CO4 citations62
US4908417AMar 13, 1990
Thermosetting resin composition
SUMITOMO CHEMICAL CO4 citations61
US5854370ADec 29, 1998
Epoxy resin stilbenes and process for producing the same by photoisomerization
SUMITOMO CHEMICAL CO1 citations52
US5705596AJan 6, 1998
Epoxy resin and process for producing the same
SUMITOMO CHEMICAL CO0 citations52
US5560968AOct 1, 1996
Semiconductor device encapsulated with an epoxy resin and a process for encapsulation
SUMITOMO CHEMICAL CO0 citations52
US5462997AOct 31, 1995
Polyhydric phenol, and epoxy resin and epoxy resin composition derived therefrom
SUMITOMO CHEMICAL CO0 citations52
US7919550B2Apr 5, 2011
Encapsulant of epoxy group-containing (meth)acrylic polymer, anhydride and (meth)acrylic monomer
SUMITOMO CHEMICAL CO0 citations48