Inventor
KRAUS CHARLES J
US5 patents
⚠️ This page may combine multiple inventors who share the name “KRAUS CHARLES J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
4 patentsUS4688151AAug 18, 1987
Multilayered interposer board for powering high current chip modules
IBM119 citations95
US4803595AFeb 7, 1989
Interposer chip technique for making engineering changes between interconnected semiconductor chips
IBM106 citations94
US4535388AAug 13, 1985
High density wired module
IBM16 citations73
US4546413AOct 8, 1985
Engineering change facility on both major surfaces of chip module
IBM13 citations72