Inventor
WU LEON L
US18 patents
⚠️ This page may combine multiple inventors who share the name “WU LEON L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
13 patentsUS4688151AAug 18, 1987
Multilayered interposer board for powering high current chip modules
IBM119 citations95
US5397747AMar 14, 1995
Vertical chip mount memory package and method
IBM96 citations94
US5362986ANov 8, 1994
Vertical chip mount memory package with packaging substrate and memory chip pairs
IBM64 citations94
US4803595AFeb 7, 1989
Interposer chip technique for making engineering changes between interconnected semiconductor chips
IBM106 citations94
US6104629AAug 15, 2000
High frequency memory module
IBM21 citations92
US4274124AJun 16, 1981
Thick film capacitor having very low internal inductance
IBM36 citations92
US5365204ANov 15, 1994
CMOS voltage controlled ring oscillator
IBM22 citations91
US4553050ANov 12, 1985
Transmission line terminator-decoupling capacitor chip for off-chip driver
IBM21 citations81
US5294754AMar 15, 1994
Direct write EC single metal layer
IBM13 citations73
US4535388AAug 13, 1985
High density wired module
IBM16 citations73
US4035607AJul 12, 1977
Integrated heater element array
IBM14 citations73
US3953264AApr 27, 1976
Integrated heater element array and fabrication method
IBM15 citations73
US5754399AMay 19, 1998
Direct coupled CPU package
IBM5 citations62