Inventor

STOLLER HERBERT I

US23 patents

⚠️ This page may combine multiple inventors who share the name “STOLLER HERBERT I”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STOLLER HERBERT I

IBM

High k dielectric capacitor with low k sheathed signal vias

Method of manufacture of silicon based package

Structure for a thin film multilayer capacitor

Direct deposit thin film single/multi chip module

Internal resistor termination in multi-chip module environments

Multilayered interposer board for powering high current chip modules

Method of manufacture of silicon based package and devices manufactured thereby

High k dielectric material with low k dielectric sheathed signal vias

Semiconductor package containing multiple memory units

Method for a thin film multilayer capacitor

Method for making high k dielectric material with low k dielectric sheathed signal vias

Direct distribution repair and engineering change system

Direct deposit thin film single/multi chip module

Silicon based package

Apparatus and method for repairing electronic packages

Multiple power density chip structure

High density wired module

Selective epitaxy method for making filamentary pedestal transistor

Engineering change facility on both major surfaces of chip module

Jogging structure for wiring translation between grids with non-integral pitch ratios in chip carrier modules

Jogging structure for wiring translation between grids with non-integral pitch ratios in chip carrier modules

GROBMAN WARREN D

Electronics system with direct write engineering change capability

MAGERLEIN JOHN H

Method and manufacture of silicon based package and devices manufactured thereby