Inventor

ZUMBRUNNEN MICHAEL L

US15 patents

⚠️ This page may combine multiple inventors who share the name “ZUMBRUNNEN MICHAEL L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

11 patents

US5016090AMay 14, 1991

Cross-hatch flow distribution and applications thereof

IBM215 citations97

US5228502AJul 20, 1993

Cooling by use of multiple parallel convective surfaces

IBM82 citations96

US5161089ANov 3, 1992

Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same

IBM106 citations96

US6261404B1Jul 17, 2001

Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device

IBM52 citations95

US5905636AMay 18, 1999

Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device

IBM72 citations95

US5745344AApr 28, 1998

Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device

IBM67 citations95

US5170319ADec 8, 1992

Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels

IBM68 citations95

US5611696AMar 18, 1997

High density and high current capacity pad-to-pad connector comprising of spring connector elements (SCE)

IBM56 citations92

US5005638AApr 9, 1991

Thermal conduction module with barrel shaped piston for improved heat transfer

IBM26 citations92

US4765400AAug 23, 1988

Circuit module with pins conducting heat from floating plate contacting heat producing device

IBM74 citations92

US5608966AMar 11, 1997

Process for manufacture of spring contact elements and assembly thereof

IBM19 citations80

JDS UNIPHASE CORP

4 patents

US7178996B2Feb 20, 2007

ZUMBRUNNEN MICHAEL L

IBM

Cross-hatch flow distribution and applications thereof

Cooling by use of multiple parallel convective surfaces

Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same

Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device

Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device

Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device

Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels

High density and high current capacity pad-to-pad connector comprising of spring connector elements (SCE)

Thermal conduction module with barrel shaped piston for improved heat transfer

Circuit module with pins conducting heat from floating plate contacting heat producing device

Process for manufacture of spring contact elements and assembly thereof

JDS UNIPHASE CORP

High density optical transceiver

Optical transceiver bail latch

Heat dissipating cages for optical transceiver systems

Optical cage system preventing insertion of incorrect module