Inventor

CHI TOM Y

US8 patents

Patents

8 patents

US5378926AJan 3, 1995

Bonding of integrated circuit chip to carrier using gold/tin eutectic alloy and refractory metal nitride barrier layer to block migration of tin through via holes

HUGHES AIRCRAFT CO98 citations92

US5350662ASep 27, 1994

Maskless process for forming refractory metal layer in via holes of GaAs chips

HUGHES AIRCRAFT CO32 citations91

US5705432AJan 6, 1998

Process for providing clean lift-off of sputtered thin film layers

HUGHES AIRCRAFT CO24 citations89

US5283452AFeb 1, 1994

Distributed cell monolithic mircowave integrated circuit (MMIC) field-effect transistor (FET) amplifier

HUGHES AIRCRAFT CO43 citations89

US5156998AOct 20, 1992

Bonding of integrated circuit chip to carrier using gold/tin eutectic alloy and refractory metal barrier layer to block migration of tin through via holes

HUGHES AIRCRAFT CO40 citations89

US5556797ASep 17, 1996

Method of fabricating a self-aligned double recess gate profile

HUGHES AIRCRAFT CO19 citations79

US5539228AJul 23, 1996

Field-effect transistor with high breakdown voltage provided by channel recess offset toward drain

HUGHES AIRCRAFT CO8 citations72

US5436201AJul 25, 1995

Dual etchant process, particularly for gate recess fabrication in GaAs MMIC chips

HUGHES AIRCRAFT CO13 citations71