Inventor
RUDIK WILLIAM JOHN
US16 patents
⚠️ This page may combine multiple inventors who share the name “RUDIK WILLIAM JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
15 patentsUS5981880ANov 9, 1999
Electronic device packages having glass free non conductive layers
IBM33 citations92
US5719090AFeb 17, 1998
Technique for forming resin-imprenated fiberglass sheets with improved resistance to pinholing
IBM17 citations92
US5858461AJan 12, 1999
Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing
IBM14 citations82
US5780366AJul 14, 1998
Technique for forming resin-impregnated fiberglass sheets using multiple resins
IBM14 citations82
US6136733AOct 24, 2000
Method for reducing coefficient of thermal expansion in chip attach packages
IBM15 citations80
US5871819AFeb 16, 1999
Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing
IBM11 citations74
US6739048B2May 25, 2004
Process of fabricating a circuitized structure
IBM12 citations73
US6131279AOct 17, 2000
Integrated manufacturing packaging process
IBM14 citations73
US6841026B2Jan 11, 2005
Method for reducing coefficient of thermal expansion in chip attach packages
IBM6 citations72
US6586352B1Jul 1, 2003
Method for reducing coefficient of thermal expansion in chip attach packages
IBM10 citations72
US6387830B1May 14, 2002
Method for reducing coefficient of thermal expansion in chip attach packages
IBM9 citations72
US5955782ASep 21, 1999
Apparatus and process for improved die adhesion to organic chip carriers
IBM13 citations69
US6096665AAug 1, 2000
Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing
IBM2 citations63
US5866203AFeb 2, 1999
Technique for forming resin-impregnated fiberglass sheets using multiple resins
IBM1 citations63
US5874370AFeb 23, 1999
Technique for forming resin-impregnated fiberglass sheets using multiple resins
IBM0 citations52