Inventor
RODBELL KENNETH PARKER
US15 patents
⚠️ This page may combine multiple inventors who share the name “RODBELL KENNETH PARKER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
14 patentsUS6451712B1Sep 17, 2002
Method for forming a porous dielectric material layer in a semiconductor device and device formed
IBM123 citations99
US6709562B1Mar 23, 2004
Method of making electroplated interconnection structures on integrated circuit chips
IBM90 citations97
US6268291B1Jul 31, 2001
Method for forming electromigration-resistant structures by doping
IBM183 citations95
US6589874B2Jul 8, 2003
Method for forming electromigration-resistant structures by doping
IBM52 citations94
US6429523B1Aug 6, 2002
Method for forming interconnects on semiconductor substrates and structures formed
IBM32 citations92
US6448173B1Sep 10, 2002
Aluminum-based metallization exhibiting reduced electromigration and method therefor
IBM21 citations91
US6110819AAug 29, 2000
Interconnect structure using Al2 Cu for an integrated circuit chip
IBM24 citations90
US5925933AJul 20, 1999
Interconnect structure using Al2 -Cu for an integrated circuit chip
IBM34 citations90
US6831364B2Dec 14, 2004
Method for forming a porous dielectric material layer in a semiconductor device and device formed
IBM6 citations74
US6570255B2May 27, 2003
Method for forming interconnects on semiconductor substrates and structures formed
IBM7 citations73
US6346175B1Feb 12, 2002
Modification of in-plate refractory metal texture by use of refractory metal/nitride layer
IBM2 citations62
US6396151B1May 28, 2002
Partially-overlapped interconnect structure and method of making
IBM4 citations59
US8362600B2Jan 29, 2013
Method and structure to reduce soft error rate susceptibility in semiconductor structures
IBM1 citations48
US7172968B2Feb 6, 2007
Ultra thin, single phase, diffusion barrier for metal conductors
IBM0 citations48