Inventor
FUJISAWA ATSUSHI
JP30 patents
⚠️ This page may combine multiple inventors who share the name “FUJISAWA ATSUSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUMITOMO WIRING SYSTEMS
5 patentsUS6156976ADec 5, 2000
Protective construction for splice portion
SUMITOMO WIRING SYSTEMS16 citations92
US5901441AMay 11, 1999
Protective construction for splice portion
SUMITOMO WIRING SYSTEMS9 citations73
US5432300AJul 11, 1995
Protecting construction for end portion of shielded electric cable
SUMITOMO WIRING SYSTEMS8 citations70
US5757955AMay 26, 1998
Method for checking a connection of wires and control apparatus
SUMITOMO WIRING SYSTEMS2 citations60
US5716206AFeb 10, 1998
Apparatus for heating a wire connection or connector
SUMITOMO WIRING SYSTEMS1 citations49
HITACHI HOKKAI SEMICONDUCTOR
5 patentsUS6437428B1Aug 20, 2002
Ball grid array type semiconductor package having a flexible substrate
HITACHI HOKKAI SEMICONDUCTOR9 citations81
US6887739B2May 3, 2005
Method of manufacturing semiconductor package including forming a resin sealing member
HITACHI HOKKAI SEMICONDUCTOR5 citations73
US6476466B2Nov 5, 2002
Ball grid array type semiconductor package having a flexible substrate
HITACHI HOKKAI SEMICONDUCTOR4 citations73
US6448111B1Sep 10, 2002
Method of manufacturing a semiconductor device
HITACHI HOKKAI SEMICONDUCTOR4 citations73
US6909179B2Jun 21, 2005
Lead frame and semiconductor device using the lead frame and method of manufacturing the same
HITACHI HOKKAI SEMICONDUCTOR8 citations70
HITACHI LTD
4 patentsUS6232650B1May 15, 2001
Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuiting
HITACHI LTD94 citations98
US6551862B2Apr 22, 2003
Semiconductor device and method of manufacturing the same
HITACHI LTD37 citations89
US6265762B1Jul 24, 2001
Lead frame and semiconductor device using the lead frame and method of manufacturing the same
HITACHI LTD41 citations89
US6590275B2Jul 8, 2003
Ball grid array type semiconductor package having a flexible substrate
HITACHI LTD10 citations82
FUJISAWA ATSUSHI
4 patentsUS9006871B2Apr 14, 2015
Semiconductor device and method of manufacturing the same
FUJISAWA ATSUSHI17 citations92
US8193024B2Jun 5, 2012
Manufacturing method for semiconductor devices and semiconductor device
FUJISAWA ATSUSHI8 citations83
US9087850B2Jul 21, 2015
Method for manufacturing semiconductor device
FUJISAWA ATSUSHI4 citations72
US8609468B2Dec 17, 2013
Semiconductor device and method of manufacturing the same
FUJISAWA ATSUSHI3 citations62
RENESAS TECH CORP
4 patentsUS6764878B2Jul 20, 2004
Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate
RENESAS TECH CORP13 citations92
US7348659B2Mar 25, 2008
Semiconductor device and method of manufacturing thereof
RENESAS TECH CORP13 citations83
US6759279B2Jul 6, 2004
Method of manufacturing semiconductor device having resin sealing body
RENESAS TECH CORP2 citations62
US7579674B2Aug 25, 2009
Semiconductor package configuration with improved lead portion arrangement
RENESAS TECH CORP0 citations51
RENESAS ELECTRONICS CORP
3 patentsUS9263274B2Feb 16, 2016
Method for manufacturing semiconductor device
RENESAS ELECTRONICS CORP2 citations63
US9324644B2Apr 26, 2016
Semiconductor device
RENESAS ELECTRONICS CORP0 citations52
US9184142B2Nov 10, 2015
Semiconductor device and manufacturing method of the same
RENESAS ELECTRONICS CORP0 citations52