Inventor
KONNO TAKAFUMI
JP18 patents
⚠️ This page may combine multiple inventors who share the name “KONNO TAKAFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
6 patentsUS6232650B1May 15, 2001
Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuiting
HITACHI LTD94 citations98
US6396142B1May 28, 2002
Semiconductor device
HITACHI LTD21 citations92
US6551862B2Apr 22, 2003
Semiconductor device and method of manufacturing the same
HITACHI LTD37 citations89
US6265762B1Jul 24, 2001
Lead frame and semiconductor device using the lead frame and method of manufacturing the same
HITACHI LTD41 citations89
US6590275B2Jul 8, 2003
Ball grid array type semiconductor package having a flexible substrate
HITACHI LTD10 citations82
US6673655B2Jan 6, 2004
Method of making semiconductor device having improved heat radiation plate arrangement
HITACHI LTD2 citations62
HITACHI HOKKAI SEMICONDUCTOR
5 patentsUS6437428B1Aug 20, 2002
Ball grid array type semiconductor package having a flexible substrate
HITACHI HOKKAI SEMICONDUCTOR9 citations81
US6887739B2May 3, 2005
Method of manufacturing semiconductor package including forming a resin sealing member
HITACHI HOKKAI SEMICONDUCTOR5 citations73
US6476466B2Nov 5, 2002
Ball grid array type semiconductor package having a flexible substrate
HITACHI HOKKAI SEMICONDUCTOR4 citations73
US6448111B1Sep 10, 2002
Method of manufacturing a semiconductor device
HITACHI HOKKAI SEMICONDUCTOR4 citations73
US6909179B2Jun 21, 2005
Lead frame and semiconductor device using the lead frame and method of manufacturing the same
HITACHI HOKKAI SEMICONDUCTOR8 citations70
RENESAS TECH CORP
3 patentsUS6764878B2Jul 20, 2004
Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate
RENESAS TECH CORP13 citations92
US6803258B2Oct 12, 2004
Semiconductor device
RENESAS TECH CORP5 citations73
US6759279B2Jul 6, 2004
Method of manufacturing semiconductor device having resin sealing body
RENESAS TECH CORP2 citations62