Inventor
PYO SUNG GYU
KR27 patents
⚠️ This page may combine multiple inventors who share the name “PYO SUNG GYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HYNIX SEMICONDUCTOR INC
12 patentsUS6849298B2Feb 1, 2005
Method for forming diffusion barrier film of semiconductor device
HYNIX SEMICONDUCTOR INC21 citations92
US6413864B1Jul 2, 2002
Method of manufacturing a copper metal wiring in a semiconductor device
HYNIX SEMICONDUCTOR INC44 citations92
US7041566B2May 9, 2006
Method for forming inductor in semiconductor device
HYNIX SEMICONDUCTOR INC11 citations84
US6846364B2Jan 25, 2005
Heater block having catalyst spray means
HYNIX SEMICONDUCTOR INC16 citations84
US6593236B2Jul 15, 2003
Method of forming a metal wiring in a semiconductor device with copper seed
HYNIX SEMICONDUCTOR INC18 citations84
US7037800B2May 2, 2006
Radio frequency semiconductor device and method of manufacturing the same
HYNIX SEMICONDUCTOR INC7 citations74
US6627523B2Sep 30, 2003
Method of forming a metal wiring in a semiconductor device
HYNIX SEMICONDUCTOR INC7 citations74
US6468907B2Oct 22, 2002
Method of manufacturing a copper wiring in a semiconductor device
HYNIX SEMICONDUCTOR INC8 citations74
US6436826B1Aug 20, 2002
Method of forming a metal wiring in a semiconductor device
HYNIX SEMICONDUCTOR INC11 citations74
US6551932B2Apr 22, 2003
Method for forming metal line in a semiconductor device
HYNIX SEMICONDUCTOR INC5 citations63
US6528415B2Mar 4, 2003
Method of forming a metal line in a semiconductor device
HYNIX SEMICONDUCTOR INC3 citations63
US6723645B2Apr 20, 2004
Method of forming a metal wiring in a semiconductor device
HYNIX SEMICONDUCTOR INC1 citations52
HYUNDAI ELECTRONICS IND
7 patentsUS6492268B1Dec 10, 2002
Method of forming a copper wiring in a semiconductor device
HYUNDAI ELECTRONICS IND22 citations92
US6349887B1Feb 26, 2002
Liquid delivery system
HYUNDAI ELECTRONICS IND38 citations92
US6337276B1Jan 8, 2002
Methods of forming a copper wiring in a semiconductor device using chemical vapor deposition
HYUNDAI ELECTRONICS IND9 citations74
US6645858B2Nov 11, 2003
Method of catalyzing copper deposition in a damascene structure by plasma treating the barrier layer and then applying a catalyst such as iodine or iodine compounds to the barrier layer
HYUNDAI ELECTRONICS IND9 citations73
US6346478B1Feb 12, 2002
Method of forming a copper wiring in a semiconductor device
HYUNDAI ELECTRONICS IND8 citations72
US6617238B2Sep 9, 2003
Method of manufacturing a metal wiring in a semiconductor device
HYUNDAI ELECTRONICS IND1 citations52
US6376356B2Apr 23, 2002
Method of manufacturing a metal wiring in a semiconductor device
HYUNDAI ELECTRONICS IND0 citations52
MAGNACHIP SEMICONDUCTOR LTD
4 patentsUS7948043B2May 24, 2011
MEMS package that includes MEMS device wafer bonded to cap wafer and exposed array pads
MAGNACHIP SEMICONDUCTOR LTD7 citations84
US7557441B2Jul 7, 2009
Package of MEMS device and method for fabricating the same
MAGNACHIP SEMICONDUCTOR LTD5 citations74
US7615394B2Nov 10, 2009
Method for fabricating MEMS device package that includes grinding MEMS device wafer to expose array pads corresponding to a cap wafer
MAGNACHIP SEMICONDUCTOR LTD3 citations63
US8357560B2Jan 22, 2013
Package of MEMS device and method for fabricating the same
MAGNACHIP SEMICONDUCTOR LTD1 citations52