Inventor

KOIZUMI NAOYUKI

JP50 patents

⚠️ This page may combine multiple inventors who share the name “KOIZUMI NAOYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOIZUMI NAOYUKI

SHINKO ELECTRIC IND CO

Process for fabricating bump electrode

Semiconductor device and process for producing same

Semiconductor chip and fabrication method thereof

Semiconductor device having additional functional element and method of manufacturing thereof

Semiconductor chip mounting board and method of inspecting the same mounting board

Wiring substrate and method of manufacturing the same

Wiring substrate and manufacturing method thereof

Light-emitting device and method for manufacturing the same

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Method for manufacturing semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Method for manufacturing semiconductor package having electrodes penetrating through semiconductor wafer

Method for manufacturing thin semiconductor chip

Method of manufacturing micro-semiconductor element

Light emitting apparatus and manufacturing method therefor

Sealed structure and method of fabricating sealed structure and semiconductor device and method of fabricating semiconductor device

Semiconductor device and method for manufacturing the same

Light emitting device and manufacturing method thereof

Electrical characteristic measuring probe and method of manufacturing the same

Multilayer wiring board and semiconductor device

Electrostatic chuck and substrate fixing device

Electrostatic adsorption member and substrate fixing device

Wiring substrate and method of manufacturing the same

Wiring substrate, method of manufacturing the same, and semiconductor device

Light-emitting device and method for manufacturing the same

Semiconductor device package, semiconductor apparatus, and methods for manufacturing the same

Method of producing light emitting apparatus

Semiconductor device and method of manufacturing the same

Optical device

Package for semiconductor device and method of manufacturing the same

Wiring substrate having multiple core substrates

Wiring board having efficiently arranged pads

TEIKOKU HORMONE MFG CO LTD

Benzothiophene derivative

Antiulcer phenoxypropylamine derivatives

Phenyl sulfamate derivatives

3-substituted-D-homo-1,3,5(10)-estratriene derivatives

Oxa- or azasteroid derivatives

Compositions and methods employing 2-oxa- or -aza-pregnan compounds for inhibiting androgen or supplying progestin in mammals

2-oxa- or -aza-pregnane compounds

7-substituted oxa- or azasteroid compound

KOIZUMI NAOYUKI

Semiconductor package and method of manufacturing the same, and semiconductor device and method of manufacturing the same

Module substrate including optical transmission mechanism and method of producing the same

Electric part package and manufacturing method thereof

Wiring substrate, semiconductor device and manufacturing method thereof

MURAYAMA KEI

Semiconductor device having an element mounted on a substrate and an electrical component connected to the element

KUNIMOTO YUJI

Wiring substrate, method of manufacturing the same, and semiconductor device

SHIRAISHI AKINORI

Substrate and method for manufacturing the same

FURUICHI JUN

Wiring substrate and method of manufacturing the same

ASKA PHARM CO LTD

Cyclic aminophenyl sulfamate derivative