Inventor
YANG JICHENG
US21 patents
⚠️ This page may combine multiple inventors who share the name “YANG JICHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
9 patentsUS6759307B1Jul 6, 2004
Method to prevent die attach adhesive contamination in stacked chips
MICRON TECHNOLOGY INC90 citations98
US6274930B1Aug 14, 2001
Multi-chip module with stacked dice
MICRON TECHNOLOGY INC84 citations97
US6207467B1Mar 27, 2001
Multi-chip module with stacked dice
MICRON TECHNOLOGY INC107 citations97
US7078264B2Jul 18, 2006
Stacked semiconductor die
MICRON TECHNOLOGY INC43 citations96
US6620648B2Sep 16, 2003
Multi-chip module with extension
MICRON TECHNOLOGY INC62 citations96
US7224070B2May 29, 2007
Plurality of semiconductor die in an assembly
MICRON TECHNOLOGY INC34 citations92
US6580160B2Jun 17, 2003
Coupling spaced bond pads to a contact
MICRON TECHNOLOGY INC7 citations74
US6453547B1Sep 24, 2002
Coupling spaced bond pads to a contact
MICRON TECHNOLOGY INC7 citations74
US6909167B2Jun 21, 2005
Coupling spaced bond pads to a contact
MICRON TECHNOLOGY INC2 citations63