Inventor
YUE HONGYU
US24 patents
⚠️ This page may combine multiple inventors who share the name “YUE HONGYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO ELECTRON LTD
13 patentsUS6852584B1Feb 8, 2005
Method of trimming a gate electrode structure
TOKYO ELECTRON LTD134 citations96
US7167766B2Jan 23, 2007
Controlling a material processing tool and performance data
TOKYO ELECTRON LTD24 citations91
US7213478B2May 8, 2007
Method for automatic configuration of processing system
TOKYO ELECTRON LTD41 citations89
US6893975B1May 17, 2005
System and method for etching a mask
TOKYO ELECTRON LTD17 citations84
US8048326B2Nov 1, 2011
Method and apparatus for determining an etch property using an endpoint signal
TOKYO ELECTRON LTD18 citations83
US7972483B2Jul 5, 2011
Method of fault detection for material process system
TOKYO ELECTRON LTD10 citations83
US7297287B2Nov 20, 2007
Method and apparatus for endpoint detection using partial least squares
TOKYO ELECTRON LTD10 citations80
US6825920B2Nov 30, 2004
Method and system of determining chamber seasoning condition by optical emission
TOKYO ELECTRON LTD15 citations80
US7297560B2Nov 20, 2007
Method and apparatus for detecting endpoint
TOKYO ELECTRON LTD8 citations74
US7844559B2Nov 30, 2010
Method and system for predicting process performance using material processing tool and sensor data
TOKYO ELECTRON LTD7 citations70
US7713760B2May 11, 2010
Process system health index and method of using the same
TOKYO ELECTRON LTD5 citations61
US7430496B2Sep 30, 2008
Method and apparatus for using a pressure control system to monitor a plasma processing system
TOKYO ELECTRON LTD2 citations61
US7211196B2May 1, 2007
Method and system of discriminating substrate type
TOKYO ELECTRON LTD0 citations51
ADVANCED MICRO DEVICES INC
6 patentsUS6675137B1Jan 6, 2004
Method of data compression using principal components analysis
ADVANCED MICRO DEVICES INC50 citations96
US6582618B1Jun 24, 2003
Method of determining etch endpoint using principal components analysis of optical emission spectra
ADVANCED MICRO DEVICES INC60 citations96
US6564114B1May 13, 2003
Determining endpoint in etching processes using real-time principal components analysis of optical emission spectra
ADVANCED MICRO DEVICES INC49 citations95
US6238937B1May 29, 2001
Determining endpoint in etching processes using principal components analysis of optical emission spectra with thresholding
ADVANCED MICRO DEVICES INC70 citations95
US7127358B2Oct 24, 2006
Method and system for run-to-run control
ADVANCED MICRO DEVICES INC41 citations92
US6419846B1Jul 16, 2002
Determining endpoint in etching processes using principal components analysis of optical emission spectra
ADVANCED MICRO DEVICES INC32 citations92