Inventor
KASUKABE SUSUMU
JP26 patents
⚠️ This page may combine multiple inventors who share the name “KASUKABE SUSUMU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
13 patentsUS6900646B2May 31, 2005
Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof
HITACHI LTD119 citations98
US5191708AMar 9, 1993
Manufacturing method of a probe head for semiconductor LSI inspection apparatus
HITACHI LTD151 citations97
US6305230B1Oct 23, 2001
Connector and probing system
HITACHI LTD79 citations95
US4952272AAug 28, 1990
Method of manufacturing probing head for testing equipment of semi-conductor large scale integrated circuits
HITACHI LTD105 citations94
US4931726AJun 5, 1990
Apparatus for testing semiconductor device
HITACHI LTD90 citations94
US6566150B2May 20, 2003
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step
HITACHI LTD15 citations92
US6455335B1Sep 24, 2002
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step
HITACHI LTD17 citations92
US7420380B2Sep 2, 2008
Probe card and semiconductor testing device using probe sheet or probe card semiconductor device producing method
HITACHI LTD13 citations84
US7390732B1Jun 24, 2008
Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chip
HITACHI LTD12 citations83
US6197603B1Mar 6, 2001
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step
HITACHI LTD12 citations82
US6617863B1Sep 9, 2003
Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof
HITACHI LTD12 citations74
US7285430B2Oct 23, 2007
Connection device and test system
HITACHI LTD3 citations62
US7198962B2Apr 3, 2007
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step
HITACHI LTD3 citations62
RENESAS TECH CORP
10 patentsUS7049837B2May 23, 2006
Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method
RENESAS TECH CORP65 citations97
US7227370B2Jun 5, 2007
Semiconductor inspection apparatus and manufacturing method of semiconductor device
RENESAS TECH CORP26 citations92
US6759258B2Jul 6, 2004
Connection device and test system
RENESAS TECH CORP14 citations92
US7219422B2May 22, 2007
Fabrication method of semiconductor integrated circuit device
RENESAS TECH CORP21 citations91
US7724006B2May 25, 2010
Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor device
RENESAS TECH CORP12 citations84
US7423439B2Sep 9, 2008
Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device
RENESAS TECH CORP12 citations83
US7351597B2Apr 1, 2008
Fabrication method of semiconductor integrated circuit device
RENESAS TECH CORP10 citations82
US7656174B2Feb 2, 2010
Probe cassette, semiconductor inspection apparatus and manufacturing method of semiconductor device
RENESAS TECH CORP7 citations74
US7541202B2Jun 2, 2009
Connection device and test system
RENESAS TECH CORP1 citations62
US7534629B2May 19, 2009
Manufacturing method of semiconductor integrated circuit device
RENESAS TECH CORP4 citations60