Inventor
MORI TERUTAKA
JP11 patents
⚠️ This page may combine multiple inventors who share the name “MORI TERUTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
7 patentsUS6305230B1Oct 23, 2001
Connector and probing system
HITACHI LTD79 citations95
US6566150B2May 20, 2003
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step
HITACHI LTD15 citations92
US6455335B1Sep 24, 2002
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step
HITACHI LTD17 citations92
US7390732B1Jun 24, 2008
Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chip
HITACHI LTD12 citations83
US6197603B1Mar 6, 2001
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step
HITACHI LTD12 citations82
US7285430B2Oct 23, 2007
Connection device and test system
HITACHI LTD3 citations62
US7198962B2Apr 3, 2007
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step
HITACHI LTD3 citations62
RENESAS TECH CORP
4 patentsUS6759258B2Jul 6, 2004
Connection device and test system
RENESAS TECH CORP14 citations92
US7219422B2May 22, 2007
Fabrication method of semiconductor integrated circuit device
RENESAS TECH CORP21 citations91
US7351597B2Apr 1, 2008
Fabrication method of semiconductor integrated circuit device
RENESAS TECH CORP10 citations82
US7541202B2Jun 2, 2009
Connection device and test system
RENESAS TECH CORP1 citations62