Inventor

HESS REINHARD

DE6 patents

⚠️ This page may combine multiple inventors who share the name “HESS REINHARD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MEYER THORSTEN

2 patents

US8183696B2May 22, 2012

Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads

MEYER THORSTEN47 citations97

US8741690B2Jun 3, 2014

Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads

MEYER THORSTEN16 citations92

INFINEON TECHNOLOGIES AG

2 patents

US9576875B2Feb 21, 2017

Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements

INFINEON TECHNOLOGIES AG0 citations49

US9356092B2May 31, 2016

Semiconductor device and method for manufacturing a semiconductor device

INFINEON TECHNOLOGIES AG0 citations39

BASF AG

1 patent

US7411081B2Aug 12, 2008

Process for preparing and organometallic framework material

BASF AG48 citations91

HESS REINHARD

1 patent

US8951915B2Feb 10, 2015

Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements

HESS REINHARD6 citations76