Inventor

ABBOTT DONALD C

US79 patents

⚠️ This page may combine multiple inventors who share the name “ABBOTT DONALD C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ABBOTT DONALD C

TEXAS INSTRUMENTS INC

Lead frame structure for IC devices with strengthened encapsulation adhesion

Integrated circuit with bonding layer over active circuitry

Composite connection structure and method of manufacturing

Leadframes with selective palladium plating

Semiconductor device having substrate with differentially plated copper and selective solder

Palladium-spot leadframes for solder plated semiconductor devices and method of fabrication

Integrated circuit with bonding layer over active circuitry

Semiconductor lead frame lead stabilization

Thin tin preplated semiconductor leadframes

Flex circuit substrate for an integrated circuit package

Silver spot/palladium plate lead frame finish

Silver spot/palladium plate lead frame finish

Metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds

Structure and method of molded QFN device suitable for miniaturization, multiple rows and stacking

Low cost method to produce high volume lead frames

Semiconductor assembly having substrate with electroplated contact pads

Semiconductor device with double nickel-plated leadframe

Method for fabricating preplated nickel/palladium and tin leadframes

Semiconductor leadframes plated with lead-free solder and minimum palladium

Method to manufacture ball grid arrays with excellent solder ball adhesion for semiconductor packaging and the array

Column grid array for semiconductor packaging and method

Stabilizer/spacer for semiconductor device lead frames

Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin

Lead frame structure for IC devices with strengthened encapsulation adhesion

Method of forming a coated plastic package

Semiconductor device having post-mold nickel/palladium/gold plated leads

Leadframes for high adhesion semiconductor devices and method of fabrication

Method of making a thin film solar cell

Method of fabricating flexible circuits for integrated circuit interconnections

Copper leadframe finish for copper wire bonding

Method for fabricating a leadframe

Low cost method to produce high volume lead frames

Gold spot plated leadframes for semiconductor devices and method of fabrication

Pre-finished leadframe for semiconductor devices and method of fabrication

Lead-free, nickel-free and cyanide-free plating finish for semiconductor leadframes

Semiconductor package having etched foil capacitor integrated into leadframe

Preplating of semiconductor small outline no-lead leadframes

Silver spot/palladium plate lead frame finish

Aluminum leadframes for semiconductor QFN/SON devices

Semiconductor assembly having substrate with electroplated contact pads

Lead-free and cyanide-free plating finish for semiconductor lead frames

Method of making chip size package substrate

Semiconductor lead frame lead stabilization

Structure and method for bond pads of copper-metallized integrated circuits

Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin

ABBOTT DONALD C

Leadframe having selective planishing

Thermally improved semiconductor QFN/SON package

Method of forming metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds

Low cost lead-free preplated leadframe having improved adhesion and solderability

SIMMONS-MATTHEWS MARGARET R

IC die having TSV and wafer level underfill and stacked IC devices comprising a workpiece solder connected to the TSV