Inventor
RUDZKI JACEK
DE14 patents
⚠️ This page may combine multiple inventors who share the name “RUDZKI JACEK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DANFOSS SILICON POWER GMBH
11 patentsUS10079219B2Sep 18, 2018
Power semiconductor contact structure and method for the production thereof
DANFOSS SILICON POWER GMBH2 citations72
US11400514B2Aug 2, 2022
Sintering tool and method for sintering an electronic subassembly
DANFOSS SILICON POWER GMBH3 citations71
US10483229B2Nov 19, 2019
Sintering device
DANFOSS SILICON POWER GMBH2 citations71
US12581983B2Mar 17, 2026
Semiconductor module comprising a semiconductor and comprising a shaped metal body that is electrically contacted by the semiconductor
DANFOSS SILICON POWER GMBH0 citations58
US12125817B2Oct 22, 2024
Semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each other
DANFOSS SILICON POWER GMBH0 citations58
US10814396B2Oct 27, 2020
Sintering tool and method for sintering an electronic subassembly
DANFOSS SILICON POWER GMBH0 citations51
US10818633B2Oct 27, 2020
Sintering tool for the lower die of a sintering device
DANFOSS SILICON POWER GMBH0 citations51
US10607962B2Mar 31, 2020
Method for manufacturing semiconductor chips
DANFOSS SILICON POWER GMBH0 citations51
US10438924B2Oct 8, 2019
Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module
DANFOSS SILICON POWER GMBH0 citations51
US10332858B2Jun 25, 2019
Electronic sandwich structure with two parts joined together by means of a sintering layer
DANFOSS SILICON POWER GMBH0 citations51
US9613929B2Apr 4, 2017
Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
DANFOSS SILICON POWER GMBH1 citations51
BECKER MARTIN
2 patentsUS9786627B2Oct 10, 2017
Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
BECKER MARTIN1 citations50
US9318421B2Apr 19, 2016
Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
BECKER MARTIN0 citations50