Inventor
WAN WEN-KAI
TW15 patents
⚠️ This page may combine multiple inventors who share the name “WAN WEN-KAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
11 patentsUS7880303B2Feb 1, 2011
Stacked contact with low aspect ratio
TAIWAN SEMICONDUCTOR MFG16 citations92
US7791070B2Sep 7, 2010
Semiconductor device fault detection system and method
TAIWAN SEMICONDUCTOR MFG25 citations92
US7741714B2Jun 22, 2010
Bond pad structure with stress-buffering layer capping interconnection metal layer
TAIWAN SEMICONDUCTOR MFG36 citations92
US7291557B2Nov 6, 2007
Method for forming an interconnection structure for ic metallization
TAIWAN SEMICONDUCTOR MFG20 citations92
US7042097B2May 9, 2006
Structure for reducing stress-induced voiding in an interconnect of integrated circuits
TAIWAN SEMICONDUCTOR MFG14 citations84
US6831365B1Dec 14, 2004
Method and pattern for reducing interconnect failures
TAIWAN SEMICONDUCTOR MFG18 citations84
US6746900B1Jun 8, 2004
Method for forming a semiconductor device having high-K gate dielectric material
TAIWAN SEMICONDUCTOR MFG17 citations84
US6955984B2Oct 18, 2005
Surface treatment of metal interconnect lines
TAIWAN SEMICONDUCTOR MFG12 citations81
US7271103B2Sep 18, 2007
Surface treated low-k dielectric as diffusion barrier for copper metallization
TAIWAN SEMICONDUCTOR MFG8 citations74
US8053894B2Nov 8, 2011
Surface treatment of metal interconnect lines
TAIWAN SEMICONDUCTOR MFG3 citations62
US7777338B2Aug 17, 2010
Seal ring structure for integrated circuit chips
TAIWAN SEMICONDUCTOR MFG6 citations61
MEDIATEK INC
3 patentsUS12191226B2Jan 7, 2025
Method of manufacturing heat dissipation substrate with high thermal conductivity for semiconductor device
MEDIATEK INC0 citations62
US11587846B2Feb 21, 2023
Semiconductor device and method of forming the same
MEDIATEK INC1 citations62
US10741469B2Aug 11, 2020
Thermal via arrangement for multi-channel semiconductor device
MEDIATEK INC0 citations42