Inventor
EHMKE JOHN C
US18 patents
⚠️ This page may combine multiple inventors who share the name “EHMKE JOHN C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RAYTHEON CO
11 patentsUS6391675B1May 21, 2002
Method and apparatus for switching high frequency signals
RAYTHEON CO112 citations95
US6803534B1Oct 12, 2004
Membrane for micro-electro-mechanical switch, and methods of making and using it
RAYTHEON CO63 citations94
US6633079B2Oct 14, 2003
Wafer level interconnection
RAYTHEON CO41 citations90
US6512300B2Jan 28, 2003
Water level interconnection
RAYTHEON CO24 citations90
US6147582ANov 14, 2000
Substrate supported three-dimensional micro-coil
RAYTHEON CO24 citations87
US7535093B1May 19, 2009
Method and apparatus for packaging circuit devices
RAYTHEON CO9 citations83
US6501431B1Dec 31, 2002
Method and apparatus for increasing bandwidth of a stripline to slotline transition
RAYTHEON CO15 citations77
US6359290B1Mar 19, 2002
Self-aligned bump bond infrared focal plane array architecture
RAYTHEON CO12 citations73
US6700172B2Mar 2, 2004
Method and apparatus for switching high frequency signals
RAYTHEON CO11 citations71
US7977208B2Jul 12, 2011
Method and apparatus for packaging circuit devices
RAYTHEON CO1 citations62
US7867874B2Jan 11, 2011
Method and apparatus for packaging circuit devices
RAYTHEON CO1 citations51
TEXAS INSTRUMENTS INC
6 patentsUS6856014B1Feb 15, 2005
Method for fabricating a lid for a wafer level packaged optical MEMS device
TEXAS INSTRUMENTS INC65 citations91
US9966194B2May 8, 2018
MEMS electrostatic actuator device for RF varactor applications
TEXAS INSTRUMENTS INC6 citations81
US5298733AMar 29, 1994
Infrared focal plane array with integral slot shield using spin-on epoxy and method of making same
TEXAS INSTRUMENTS INC9 citations74
US5536680AJul 16, 1996
Self-aligned bump bond infrared focal plane array architecture
TEXAS INSTRUMENTS INC14 citations73
US9140898B2Sep 22, 2015
Hermetically sealed MEMS device and its fabrication
TEXAS INSTRUMENTS INC4 citations67
US12525444B2Jan 13, 2026
Automated overlay removal during wafer singulation
TEXAS INSTRUMENTS INC0 citations44