Inventor
GOOCH ROLAND W
US38 patents
⚠️ This page may combine multiple inventors who share the name “GOOCH ROLAND W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RAYTHEON CO
16 patentsUS6479320B1Nov 12, 2002
Vacuum package fabrication of microelectromechanical system devices with integrated circuit components
RAYTHEON CO235 citations99
US6297511B1Oct 2, 2001
High frequency infrared emitter
RAYTHEON CO123 citations97
US6690014B1Feb 10, 2004
Microbolometer and method for forming
RAYTHEON CO177 citations96
US6586831B2Jul 1, 2003
Vacuum package fabrication of integrated circuit components
RAYTHEON CO65 citations96
US6521477B1Feb 18, 2003
Vacuum package fabrication of integrated circuit components
RAYTHEON CO66 citations96
US9093444B2Jul 28, 2015
Wafer level package solder barrier used as vacuum getter
RAYTHEON CO4 citations83
US7535093B1May 19, 2009
Method and apparatus for packaging circuit devices
RAYTHEON CO9 citations83
US9227839B2Jan 5, 2016
Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling
RAYTHEON CO2 citations62
US9132496B2Sep 15, 2015
Reducing formation of oxide on solder
RAYTHEON CO2 citations62
US7977208B2Jul 12, 2011
Method and apparatus for packaging circuit devices
RAYTHEON CO1 citations62
US10315918B2Jun 11, 2019
Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays
RAYTHEON CO0 citations51
US10262913B2Apr 16, 2019
Wafer level package solder barrier used as vacuum getter
RAYTHEON CO0 citations51
US9966320B2May 8, 2018
Wafer level package solder barrier used as vacuum getter
RAYTHEON CO0 citations51
US9520332B2Dec 13, 2016
Wafer level package solder barrier used as vacuum getter
RAYTHEON CO0 citations51
US9427776B2Aug 30, 2016
Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays
RAYTHEON CO1 citations51
US7867874B2Jan 11, 2011
Method and apparatus for packaging circuit devices
RAYTHEON CO1 citations51
L 3 COMM CORP
9 patentsUS7655909B2Feb 2, 2010
Infrared detector elements and methods of forming same
L 3 COMM CORP22 citations92
US7462831B2Dec 9, 2008
Systems and methods for bonding
L 3 COMM CORP21 citations92
US7459686B2Dec 2, 2008
Systems and methods for integrating focal plane arrays
L 3 COMM CORP51 citations92
US7262412B2Aug 28, 2007
Optically blocked reference pixels for focal plane arrays
L 3 COMM CORP10 citations84
US7375331B2May 20, 2008
Optically blocked reference pixels for focal plane arrays
L 3 COMM CORP8 citations73
US7528061B2May 5, 2009
Systems and methods for solder bonding
L 3 COMM CORP4 citations62
US7514684B2Apr 7, 2009
Surface mounted infrared image detector systems and associated methods
L 3 COMM CORP1 citations52
US7220621B2May 22, 2007
Sub-wavelength structures for reduction of reflective properties
L 3 COMM CORP0 citations52
US7015074B2Mar 21, 2006
Vacuum package fabrication of integrated circuit components
L 3 COMM CORP1 citations52
TEXAS INSTRUMENTS INC
6 patentsUS6392232B1May 21, 2002
High fill factor bolometer array
TEXAS INSTRUMENTS INC63 citations96
US5777328AJul 7, 1998
Ramped foot support
TEXAS INSTRUMENTS INC57 citations96
US5449908ASep 12, 1995
Hybrid CCD imaging
TEXAS INSTRUMENTS INC45 citations95
US5789753AAug 4, 1998
Stress tolerant bolometer
TEXAS INSTRUMENTS INC44 citations92
US3965568AJun 29, 1976
Process for fabrication and assembly of semiconductor devices
TEXAS INSTRUMENTS INC24 citations82
US5543641AAug 6, 1996
Hybrid signal conditioning/infared imaging structure
TEXAS INSTRUMENTS INC6 citations73