Inventor

HICHRI HABIB

US33 patents

⚠️ This page may combine multiple inventors who share the name “HICHRI HABIB”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HICHRI HABIB

IBM

Reliable low-k interconnect structure with hybrid dielectric

Building metal pillars in a chip for structure support

Reliable low-k interconnect structure with hybrid dielectric

Method for integrating liner formation in back end of line processing

Structure and method for reducing thermo-mechanical stress in stacked vias

Low-k interlevel dielectric layer (ILD)

Building metal pillars in a chip for structure support

Reducing damage to ulk dielectric during cross-linked polymer removal

Interlevel dielectric layer and metal layer sealing

Semiconductor wafer including a low dielectric constant thermosetting polymer film and method of making same

Liner protection in deep trench etching

Deflection analysis system and method for circuit design

Optical inspection methods

Like integrated circuit devices with different depth

Conductive metal and diffusion barrier seed compositions, and methods of use in semiconductor and interlevel dielectric substrates

OCCIDENTAL CHEM CO

Polymerizing vinyl chloride in carbon dioxide

Inhibiting scale in vinyl monomer polymerization

Sulfodechlorinating aromatic compounds

Method of making m-chlorobenzotrifluoride

Reducing scale in vinyl polymerizations

Inhibiting scale in vinyl monomer polymerization

HICHRI HABIB

Method for simultaneously forming features of different depths in a semiconductor substrate

Method for simultaneously forming features of different depths in a semiconductor substrate

HU XIANG

ARC residue-free etching

Integrated circuit system with reduced polysilicon residue and method of manufacture thereof

UNIV DELAWARE

Process for preparing group Ib-IIIa-VIa semiconducting films

SRIVASTAVA RAVI PRAKASH

Method to reduce depth delta between dense and wide features in dual damascene structures

MALONE KELLY

Conductive metal and diffusion barrier seed compositions, and methods of use in semiconductor and interlevel dielectric substrates

AJINOMOTO KK

Method for making printed wiring board, printed wiring board, and adhesive film for making printed wiring board

GLOBALFOUNDRIES SG PTE LTD

ARC residue-free etching

SUSS MICROTEC PHOTONIC SYSTEMS INC

Sacrificial layer for post-laser debris removal systems

BRODSKY COLIN J

Optical inspection methods

SUSS MICROTEC PHOTOMASK EQUIPMENT GMBH & CO KG

Method and apparatus for cleaning a substrate and computer program product