Inventor

WATANABE ITSUO

JP38 patents

⚠️ This page may combine multiple inventors who share the name “WATANABE ITSUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WATANABE ITSUO

HITACHI CHEMICAL CO LTD

Circuit connecting material, and structure and method of connecting circuit terminal

Substrate for mounting semiconductor chips

Method of production of semiconductor device

Filmy adhesive for connecting circuits and circuit board

Electronic component parts device

Adhesive agent, method of connecting wiring terminals and wiring structure

Wiring board for electrical tests with bumps having polymeric coating

Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet

Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same

Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles

Circuit-connecting material and circuit terminal connected structure and connecting method

Circuit-connecting material and circuit terminal connected structure and connecting method

Adhesive for bonding circuit members, circuit board, and method of producing the same

Adhesive, method of connecting wiring terminals and wiring structure

Wiring-connecting material and wiring-connected board production process using the same

Wiring-connecting material and process for producing circuit board with the same

Process for the fabrication of wiring board for electrical tests

Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet

Circuit-connecting material and circuit terminal connected structure and connecting method

Electronic circuit including circuit-connecting material

Adhesive for bonding circuit members, circuit board and process for its production

Circuit-connecting material and circuit terminal connected structure and connecting method

Adhesive film for circuit connection, and circuit connection structure

Adhesive film for circuit connection, and circuit connection structure

Information recording medium having recording layer with organic polymer and dye contained therein

Information recording medium having recording layer with organic polymer and dye contained therein

Circuit-connecting material and circuit terminal connected structure and connecting method

Method for repairing circuit connection part, and structure and method for connecting circuit terminal of circuit repaired by the method

Circuit-connecting material and circuit terminal connected structure and connecting method

Circuit-connecting material and circuit terminal connected structure and connecting method

ARIFUKU MOTOHIRO

Adhesive, method of connecting wiring terminals and wiring structure

Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same

Wiring terminal-connecting adhesive

Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same

WATANABE ITSUO

Circuit-connecting material and circuit terminal connected structure and connecting method

Adhesive for bonding circuit members, circuit board and process for its production

Adhesive for bonding circuit members, circuit board and process for its production

Adhesive for bonding circuit members, circuit board and process for its production