P

Inventor

HARMES MICHAEL C

US5 patents
⚠️ This page may combine multiple inventors who share the name “HARMES MICHAEL C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

3 patents
US6870270B2Mar 22, 2005

Method and structure for interfacing electronic devices

INTEL CORP25 citations92
US7973407B2Jul 5, 2011

Three-dimensional stacked substrate arrangements

INTEL CORP12 citations83
US7348217B2Mar 25, 2008

Method and structure for interfacing electronic devices

INTEL CORP2 citations62

RAMANATHAN SHRIRAM

2 patents
US8421225B2Apr 16, 2013

Three-dimensional stacked substrate arrangements

RAMANATHAN SHRIRAM14 citations91
US8203208B2Jun 19, 2012

Three-dimensional stacked substrate arrangements

RAMANATHAN SHRIRAM4 citations61