Inventor
MARIEB THOMAS
US11 patents
⚠️ This page may combine multiple inventors who share the name “MARIEB THOMAS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
9 patentsUS6309956B1Oct 30, 2001
Fabricating low K dielectric interconnect systems by using dummy structures to enhance process
INTEL CORP138 citations95
US6525419B1Feb 25, 2003
Thermally coupling electrically decoupling cooling device for integrated circuits
INTEL CORP45 citations94
US5909635AJun 1, 1999
Cladding of an interconnect for improved electromigration performance
INTEL CORP21 citations91
US6646340B2Nov 11, 2003
Thermally coupling electrically decoupling cooling device for integrated circuits
INTEL CORP21 citations90
US6838299B2Jan 4, 2005
Forming defect prevention trenches in dicing streets
INTEL CORP27 citations89
US7973407B2Jul 5, 2011
Three-dimensional stacked substrate arrangements
INTEL CORP12 citations83
US6740427B2May 25, 2004
Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same
INTEL CORP13 citations81
US6794755B2Sep 21, 2004
Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement
INTEL CORP11 citations72
US11749560B2Sep 5, 2023
Cladded metal interconnects
INTEL CORP0 citations46