Inventor
KAMATH ARVIND
US57 patents
⚠️ This page may combine multiple inventors who share the name “KAMATH ARVIND”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LSI LOGIC CORP
17 patentsUS6617251B1Sep 9, 2003
Method of shallow trench isolation formation and planarization
LSI LOGIC CORP73 citations92
US6521549B1Feb 18, 2003
Method of reducing silicon oxynitride gate insulator thickness in some transistors of a hybrid integrated circuit to obtain increased differential in gate insulator thickness with other transistors of the hybrid circuit
LSI LOGIC CORP39 citations92
US6680243B1Jan 20, 2004
Shallow junction formation
LSI LOGIC CORP59 citations91
US7001823B1Feb 21, 2006
Method of manufacturing a shallow trench isolation structure with low trench parasitic capacitance
LSI LOGIC CORP11 citations84
US6544829B1Apr 8, 2003
Polysilicon gate salicidation
LSI LOGIC CORP15 citations82
US7026217B1Apr 11, 2006
Method of forming an antifuse on a semiconductor substrate using wet oxidation of a nitrided substrate
LSI LOGIC CORP15 citations80
US6656805B2Dec 2, 2003
Method of reducing silicon oxynitride gate insulator thickness in some transistors of a hybrid integrated circuit to obtain increased differential in gate insulator thickness with other transistors of the hybrid circuit
LSI LOGIC CORP5 citations73
US6562729B2May 13, 2003
Silicon nitride and silicon dioxide gate insulator transistors and method of forming same in a hybrid integrated circuit
LSI LOGIC CORP9 citations72
US6436845B1Aug 20, 2002
Silicon nitride and silicon dioxide gate insulator transistors and method of forming same in a hybrid integrated circuit
LSI LOGIC CORP13 citations72
US6586814B1Jul 1, 2003
Etch resistant shallow trench isolation in a semiconductor wafer
LSI LOGIC CORP11 citations71
US6687114B1Feb 3, 2004
High density memory with storage capacitor
LSI LOGIC CORP4 citations63
US6569739B1May 27, 2003
Method of reducing the effect of implantation damage to shallow trench isolation regions during the formation of variable thickness gate layers
LSI LOGIC CORP6 citations63
US8021955B1Sep 20, 2011
Method characterizing materials for a trench isolation structure having low trench parasitic capacitance
LSI LOGIC CORP3 citations62
US6812158B1Nov 2, 2004
Modular growth of multiple gate oxides
LSI LOGIC CORP5 citations61
US6949446B1Sep 27, 2005
Method of shallow trench isolation formation and planarization
LSI LOGIC CORP2 citations59
US6989331B2Jan 24, 2006
Hard mask removal
LSI LOGIC CORP4 citations58
US6586291B1Jul 1, 2003
High density memory with storage capacitor
LSI LOGIC CORP0 citations52
KAMATH ARVIND
8 patentsUS8446706B1May 21, 2013
High precision capacitors
KAMATH ARVIND16 citations92
US8426905B2Apr 23, 2013
Profile engineered, electrically active thin film devices
KAMATH ARVIND21 citations92
US8304780B2Nov 6, 2012
Printed dopant layers
KAMATH ARVIND10 citations84
US9299845B2Mar 29, 2016
Diffusion barrier coated substrates and methods of making the same
KAMATH ARVIND3 citations68
US8796774B2Aug 5, 2014
Printed non-volatile memory
KAMATH ARVIND1 citations63
US8264027B2Sep 11, 2012
Printed non-volatile memory
KAMATH ARVIND4 citations63
US8973231B1Mar 10, 2015
Methods for forming electrically precise capacitors, and structures formed therefrom
KAMATH ARVIND2 citations62
US9183973B2Nov 10, 2015
Diffusion barrier coated substrates and methods of making the same
KAMATH ARVIND3 citations61
THIN FILM ELECTRONICS ASA
7 patentsUS9359513B1Jun 7, 2016
Dopant inks, methods of making dopant inks, and methods of using dopant inks
THIN FILM ELECTRONICS ASA15 citations83
US9947988B2Apr 17, 2018
Wireless communication device with integrated ferrite shield and antenna, and methods of manufacturing the same
THIN FILM ELECTRONICS ASA5 citations66
US9552924B2Jan 24, 2017
Methods for forming electrically precise capacitors on insulative substrates, and structures formed therefrom
THIN FILM ELECTRONICS ASA1 citations63
US10332686B2Jun 25, 2019
High precision capacitors
THIN FILM ELECTRONICS ASA0 citations52
US9640390B1May 2, 2017
Method for modifying and controlling the threshold voltage of thin film transistors
THIN FILM ELECTRONICS ASA0 citations52
US9196641B2Nov 24, 2015
Printed dopant layers
THIN FILM ELECTRONICS ASA0 citations52
US9045653B2Jun 2, 2015
Print processing for patterned conductor, semiconductor and dielectric materials
THIN FILM ELECTRONICS ASA0 citations52
KOVIO INC
4 patentsUS7709307B2May 4, 2010
Printed non-volatile memory
KOVIO INC14 citations93
US7767520B2Aug 3, 2010
Printed dopant layers
KOVIO INC24 citations92
US7687327B2Mar 30, 2010
Methods for manufacturing RFID tags and structures formed therefrom
KOVIO INC25 citations92
US7701011B2Apr 20, 2010
Printed dopant layers
KOVIO INC19 citations84
CHANDRA ADITI
4 patentsUS8617992B2Dec 31, 2013
Method of forming metal silicide contact and metal interconnect
CHANDRA ADITI3 citations61
US8158518B2Apr 17, 2012
Methods of making metal silicide contacts, interconnects, and/or seed layers
CHANDRA ADITI2 citations61
US12555822B1Feb 17, 2026
Stacked solid state batteries and methods of making the same
CHANDRA ADITI0 citations56
US12132166B2Oct 29, 2024
Stacked solid state batteries and methods of making the same
CHANDRA ADITI0 citations56
VAN DER LINDE RICHARD
2 patentsLSI CORP
1 patentROCKENBERGER JOERG
1 patentSMITH PATRICK
1 patentSCHER ERIK
1 patentWANG ZHONGCHUN
1 patentCLEEVES JAMES MONTAGUE
1 patentGUO WENZHUO
1 patentSUBRAMANIAN VIVEK
1 patentShowing the top 50 of 57 patents by PatentIndex Score.