Inventor

LEE JIN HYUK

KR24 patents

⚠️ This page may combine multiple inventors who share the name “LEE JIN HYUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE JIN HYUK

SAMSUNG ELECTRONICS CO LTD

Method for manufacturing a wafer level chip scale package

Lead frame for a semiconductor device comprising inner leads having a locking means for preventing the movement of molding compound against the inner lead surface

Semiconductor device bonding pad resistant to stress and method of fabricating the same

Semiconductor devices with bonding pads having intermetal dielectric layer of hybrid configuration and methods of fabricating the same

Electronic device using logical channels for communication

Semiconductor device

Tape circuit substrate having wavy beam leads and semiconductor chip package using the same

Semiconductor device and manufacturing method using a stress-relieving film attached to solder joints

Reinforced bond-pad substructure and method for fabricating the same

Memory card

Method for transmitting notification information and electronic device thereof

LG ELECTRONICS INC

Method for controlling bus in digital interface

System and method for arbitrating access to a memory

Apparatus for fabricating materials

LEE JIN HYUK

Variable biometric information-based authentication system and authentication method using the same

Variable biometric information-based complex authentication system and complex authentication method using the same

Method and apparatus for variable social network service

YOON HAN BIN

Non-volatile memory device with uncorrectable information region and operation method using the same

KCC CORP

High strain-point glass composition for substrate

LEE JIN-HYUK

Data storage device and related method of operation

HYNIX SEMICONDUCTOR INC

Power divider

KIM YONG YI

Dark neutral green gray soda-lime glass composition

AGENCY DEFENSE DEV

Modified conjugated diene based polymer, manufacturing method thereof, binder composition for solid propellant comprising the same, modified conjugated diene based binder for solid propellant, and manufacturing method thereof

CHO KYUNG SANG

Devices including first and second buffers, and methods of operating devices including first and second buffers