Inventor

KHUNPUKDEE PEERADECH

TH2 patents

Patents

2 patents

US8884415B2Nov 11, 2014

IC package with stainless steel leadframe

NXP BV3 citations56

US10727168B2Jul 28, 2020

Inter-connection of a lead frame with a passive component intermediate structure

NXP BV0 citations28