Inventor
LEE JAE UNG
KR21 patents
⚠️ This page may combine multiple inventors who share the name “LEE JAE UNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
9 patentsUS9935083B2Apr 3, 2018
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC21 citations93
US10163867B2Dec 25, 2018
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC15 citations82
US10032705B2Jul 24, 2018
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC9 citations82
US9809446B1Nov 7, 2017
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC2 citations72
US11152296B2Oct 19, 2021
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC0 citations60
US10822226B2Nov 3, 2020
Semiconductor package using a polymer substrate
AMKOR TECHNOLOGY INC0 citations51
US10144634B2Dec 4, 2018
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC0 citations51
US9018741B2Apr 28, 2015
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC1 citations51
US9513254B2Dec 6, 2016
Microfluidic sensor package structure and method
AMKOR TECHNOLOGY INC0 citations39
AMKOR TECH SINGAPORE HOLDING PTE LTD
9 patentsUS11488934B2Nov 1, 2022
Semiconductor package and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD5 citations82
US10872879B2Dec 22, 2020
Semiconductor package and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD9 citations82
US11855000B2Dec 26, 2023
Semiconductor device having EMI shielding structure and related methods
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations72
US11355449B2Jun 7, 2022
Semiconductor device having EMI shielding structure and related methods
AMKOR TECH SINGAPORE HOLDING PTE LTD1 citations72
US12451441B2Oct 21, 2025
Semiconductor device having EMI shielding structure and related methods
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US12187603B2Jan 7, 2025
Semiconductor package using a polymer substrate
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations61
US12057434B2Aug 6, 2024
Semiconductor package and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations61
US11572269B2Feb 7, 2023
Semiconductor package using a polymer substrate
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations61
US12009289B2Jun 11, 2024
Semiconductor package and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations60