Inventor
CHANG BO
CN11 patents
⚠️ This page may combine multiple inventors who share the name “CHANG BO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CYPRESS SEMICONDUCTOR CORP
5 patentsUS6562272B1May 13, 2003
Apparatus and method for delamination-resistant, array type molding of increased mold cap size laminate packages
CYPRESS SEMICONDUCTOR CORP24 citations89
US7391104B1Jun 24, 2008
Non-stick detection method and mechanism for array molded laminate packages
CYPRESS SEMICONDUCTOR CORP9 citations82
US6853202B1Feb 8, 2005
Non-stick detection method and mechanism for array molded laminate packages
CYPRESS SEMICONDUCTOR CORP13 citations82
US8017445B1Sep 13, 2011
Warpage-compensating die paddle design for high thermal-mismatched package construction
CYPRESS SEMICONDUCTOR CORP17 citations81
US12190626B2Jan 7, 2025
Fingerprint sensor packages
CYPRESS SEMICONDUCTOR CORP0 citations62