Inventor
CHENG CHIA-JEN
TW12 patents
⚠️ This page may combine multiple inventors who share the name “CHENG CHIA-JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
7 patentsUS7863742B2Jan 4, 2011
Back end integrated WLCSP structure without aluminum pads
TAIWAN SEMICONDUCTOR MFG72 citations97
US7122458B2Oct 17, 2006
Method for fabricating pad redistribution layer
TAIWAN SEMICONDUCTOR MFG35 citations88
US6541366B1Apr 1, 2003
Method for improving a solder bump adhesion bond to a UBM contact layer
TAIWAN SEMICONDUCTOR MFG48 citations88
US7187078B2Mar 6, 2007
Bump structure
TAIWAN SEMICONDUCTOR MFG13 citations80
US7459386B2Dec 2, 2008
Method for forming solder bumps of increased height
TAIWAN SEMICONDUCTOR MFG14 citations79
US9087882B2Jul 21, 2015
Electrical connection for chip scale packaging
TAIWAN SEMICONDUCTOR MFG0 citations52
US7781140B2Aug 24, 2010
Method of fine pitch bump stripping
TAIWAN SEMICONDUCTOR MFG1 citations45