Inventor
BINDER BORIS
DE19 patents
⚠️ This page may combine multiple inventors who share the name “BINDER BORIS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES DRESDEN GMBH
6 patentsUS9382111B2Jul 5, 2016
Micromechanical system and method for manufacturing a micromechanical system
INFINEON TECHNOLOGIES DRESDEN GMBH13 citations84
US9546923B2Jan 17, 2017
Sensor structures, systems and methods with improved integration and optimized footprint
INFINEON TECHNOLOGIES DRESDEN GMBH3 citations71
US9376314B2Jun 28, 2016
Method for manufacturing a micromechanical system
INFINEON TECHNOLOGIES DRESDEN GMBH2 citations62
US9236241B2Jan 12, 2016
Wafer, a method for processing a wafer, and a method for processing a carrier
INFINEON TECHNOLOGIES DRESDEN GMBH2 citations62
US10060816B2Aug 28, 2018
Sensor structures, systems and methods with improved integration and optimized footprint
INFINEON TECHNOLOGIES DRESDEN GMBH0 citations51
US9752943B2Sep 5, 2017
Sensor structures, systems and methods with improved integration and optimized footprint
INFINEON TECHNOLOGIES DRESDEN GMBH0 citations51
INFINEON TECHNOLOGIES AG
6 patentsUS7832279B2Nov 16, 2010
Semiconductor device including a pressure sensor
INFINEON TECHNOLOGIES AG12 citations81
US8921974B2Dec 30, 2014
Semiconductor manufacturing and semiconductor device with semiconductor structure
INFINEON TECHNOLOGIES AG2 citations62
US8921954B2Dec 30, 2014
Method of providing a semiconductor structure with forming a sacrificial structure
INFINEON TECHNOLOGIES AG2 citations62
US12563854B2Feb 24, 2026
Heteroepitaxial semiconductor device and method for fabricating a heteroepitaxial semiconductor device
INFINEON TECHNOLOGIES AG0 citations51
US11393714B2Jul 19, 2022
Producing a buried cavity in a semiconductor substrate
INFINEON TECHNOLOGIES AG0 citations51
US9527725B2Dec 27, 2016
Semiconductor structure with lamella defined by singulation trench
INFINEON TECHNOLOGIES AG1 citations51
KAUTZSCH THORALF
5 patentsUS8481400B2Jul 9, 2013
Semiconductor manufacturing and semiconductor device with semiconductor structure
KAUTZSCH THORALF9 citations83
US8518732B2Aug 27, 2013
Method of providing a semiconductor structure with forming a sacrificial structure
KAUTZSCH THORALF3 citations61
US8994127B2Mar 31, 2015
Method of fabricating isolating semiconductor structures using a layout of trenches and openings
KAUTZSCH THORALF3 citations60
US8266962B2Sep 18, 2012
Acceleration sensor
KAUTZSCH THORALF4 citations60
US8627720B2Jan 14, 2014
Acceleration sensor
KAUTZSCH THORALF0 citations49