Inventor
KASKOUN KENNETH
US33 patents
⚠️ This page may combine multiple inventors who share the name “KASKOUN KENNETH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
13 patentsUS9955939B2May 1, 2018
Stethoscope system including a sensor array
QUALCOMM INC37 citations93
US7939926B2May 10, 2011
Via first plus via last technique for IC interconnects
QUALCOMM INC15 citations92
US10271745B2Apr 30, 2019
Monolithic integrated emitter-detector array in a flexible substrate for biometric sensing
QUALCOMM INC8 citations84
US9721409B2Aug 1, 2017
Biometrics for user identification in mobile health systems
QUALCOMM INC8 citations84
US9138191B1Sep 22, 2015
Integrated circuit module with lead frame micro-needles
QUALCOMM INC7 citations83
US9974484B2May 22, 2018
Methods, devices and systems for sensor with removable nodes
QUALCOMM INC8 citations82
US9615794B2Apr 11, 2017
Method, devices and systems for sensor with removable nodes
QUALCOMM INC9 citations82
US7985620B2Jul 26, 2011
Method of fabricating via first plus via last IC interconnect
QUALCOMM INC5 citations73
US9385560B2Jul 5, 2016
Methods, devices and systems for self charging sensors
QUALCOMM INC2 citations61
US10182710B2Jan 22, 2019
Wearable dual-ear mobile otoscope
QUALCOMM INC1 citations58
US10025917B2Jul 17, 2018
Biometrics for user identification in mobile health systems
QUALCOMM INC1 citations52
US9478528B2Oct 25, 2016
Devices, systems and methods using through silicon optical interconnects
QUALCOMM INC0 citations52
US9202705B1Dec 1, 2015
Integrated circuit module with lead frame micro-needles
QUALCOMM INC0 citations51
MOTOROLA INC
5 patentsUS5661088AAug 26, 1997
Electronic component and method of packaging
MOTOROLA INC175 citations97
US6166556ADec 26, 2000
Method for testing a semiconductor device and semiconductor device tested thereby
MOTOROLA INC58 citations96
US5860585AJan 19, 1999
Substrate for transferring bumps and method of use
MOTOROLA INC71 citations95
US5816478AOct 6, 1998
Fluxless flip-chip bond and a method for making
MOTOROLA INC64 citations95
US6001493ADec 14, 1999
Substrate for transferring bumps and method of use
MOTOROLA INC26 citations92
KASKOUN KENNETH
5 patentsUS8502373B2Aug 6, 2013
3-D integrated circuit lateral heat dissipation
KASKOUN KENNETH2 citations61
US8080862B2Dec 20, 2011
Systems and methods for enabling ESD protection on 3-D stacked devices
KASKOUN KENNETH3 citations61
US8847360B2Sep 30, 2014
Systems and methods for enabling ESD protection on 3-D stacked devices
KASKOUN KENNETH0 citations51
US8076768B2Dec 13, 2011
IC interconnect
KASKOUN KENNETH0 citations50
US8717057B2May 6, 2014
Integrated tester chip using die packaging technologies
KASKOUN KENNETH0 citations40
AMKOR TECHNOLOGY INC
4 patentsUS6624005B1Sep 23, 2003
Semiconductor memory cards and method of making same
AMKOR TECHNOLOGY INC304 citations99
US6900527B1May 31, 2005
Lead-frame method and assembly for interconnecting circuits within a circuit module
AMKOR TECHNOLOGY INC6 citations71
US7176062B1Feb 13, 2007
Lead-frame method and assembly for interconnecting circuits within a circuit module
AMKOR TECHNOLOGY INC2 citations60
US7019387B1Mar 28, 2006
Lead-frame connector and circuit module assembly
AMKOR TECHNOLOGY INC4 citations57