Inventor
NOWAK MATTHEW
US27 patents
⚠️ This page may combine multiple inventors who share the name “NOWAK MATTHEW”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KIM JONGHAE
7 patentsUS8143952B2Mar 27, 2012
Three dimensional inductor and transformer
KIM JONGHAE14 citations83
US8067816B2Nov 29, 2011
Techniques for placement of active and passive devices within a chip
KIM JONGHAE7 citations83
US8988130B2Mar 24, 2015
Method and apparatus for providing through silicon via (TSV) redundancy
KIM JONGHAE6 citations73
US8508301B2Aug 13, 2013
Three dimensional inductor, transformer and radio frequency amplifier
KIM JONGHAE3 citations62
US8471643B2Jun 25, 2013
Electromechanical systems oscillator with piezoelectric contour mode resonator for multiple frequency generation
KIM JONGHAE4 citations62
US8324066B2Dec 4, 2012
Techniques for placement of active and passive devices within a chip
KIM JONGHAE3 citations62
US8081037B2Dec 20, 2011
Ring oscillator using analog parallelism
KIM JONGHAE0 citations41
QUALCOMM INC
6 patentsUS7728622B2Jun 1, 2010
Software programmable logic using spin transfer torque magnetoresistive random access memory
QUALCOMM INC47 citations97
US8889431B2Nov 18, 2014
Magnetic tunnel junction (MTJ) and methods, and magnetic random access memory (MRAM) employing same
QUALCOMM INC9 citations84
US8350358B2Jan 8, 2013
Techniques for placement of active and passive devices within a chip
QUALCOMM INC7 citations84
US8344433B2Jan 1, 2013
Magnetic tunnel junction (MTJ) and methods, and magnetic random access memory (MRAM) employing same
QUALCOMM INC8 citations84
US7829923B2Nov 9, 2010
Magnetic tunnel junction and method of fabrication
QUALCOMM INC8 citations84
US8350639B2Jan 8, 2013
Transformer signal coupling for flip-chip integration
QUALCOMM INC3 citations63
LI XIA
3 patentsUS8483997B2Jul 9, 2013
Predictive modeling of contact and via modules for advanced on-chip interconnect technology
LI XIA5 citations73
US8429577B2Apr 23, 2013
Predictive modeling of interconnect modules for advanced on-chip interconnect technology
LI XIA3 citations63
US9190201B2Nov 17, 2015
Magnetic film enhanced inductor
LI XIA3 citations62
KASKOUN KENNETH
3 patentsUS8502373B2Aug 6, 2013
3-D integrated circuit lateral heat dissipation
KASKOUN KENNETH2 citations61
US8080862B2Dec 20, 2011
Systems and methods for enabling ESD protection on 3-D stacked devices
KASKOUN KENNETH3 citations61
US8847360B2Sep 30, 2014
Systems and methods for enabling ESD protection on 3-D stacked devices
KASKOUN KENNETH0 citations51