Inventor
NEKKANTY SRIKANT
US31 patents
⚠️ This page may combine multiple inventors who share the name “NEKKANTY SRIKANT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
29 patentsUS10535615B2Jan 14, 2020
Electronic package that includes multi-layer stiffener
INTEL CORP2 citations72
US9692147B1Jun 27, 2017
Small form factor sockets and connectors
INTEL CORP5 citations72
US9953909B2Apr 24, 2018
Ball grid array (BGA) with anchoring pins
INTEL CORP2 citations70
US9780510B2Oct 3, 2017
Socket contact techniques and configurations
INTEL CORP3 citations70
US11808988B2Nov 7, 2023
Method and device for fast, passive alignment in photonics assembly
INTEL CORP2 citations68
US12523827B2Jan 13, 2026
Photonic integrated circuit to glass substrate alignment through dual cylindrical lens
INTEL CORP0 citations62
US11862547B2Jan 2, 2024
Differential crosstalk self-cancelation in stackable structures
INTEL CORP0 citations62
US11212932B2Dec 28, 2021
Pin count socket having reduced pin count and pattern transformation
INTEL CORP0 citations62
US12413001B2Sep 9, 2025
Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic package
INTEL CORP0 citations61
US12341281B2Jun 24, 2025
Micro socket electrical couplings for dies
INTEL CORP0 citations61
US10541494B2Jan 21, 2020
Connector for processor package
INTEL CORP1 citations61
US12506083B2Dec 23, 2025
Liquid metal interconnect for modular package server architecture
INTEL CORP0 citations60
US12153269B2Nov 26, 2024
Active optical coupler
INTEL CORP1 citations60
US10205292B2Feb 12, 2019
Socket contact techniques and configurations
INTEL CORP1 citations60
US12174436B2Dec 24, 2024
Package expanded beam connector for on-package optics
INTEL CORP0 citations59
US12493151B2Dec 9, 2025
Method and device for fast, passive alignment in photonics assembly
INTEL CORP0 citations57
US11830863B2Nov 28, 2023
Dual-sided co-packaged optics for high bandwidth networking applications
INTEL CORP0 citations56
US11217573B2Jan 4, 2022
Dual-sided co-packaged optics for high bandwidth networking applications
INTEL CORP0 citations56
US11569596B2Jan 31, 2023
Pressure features to alter the shape of a socket
INTEL CORP0 citations53
US12298572B2May 13, 2025
Device, method and system for optical communication with a photonic integrated circuit chip and a transverse oriented lens structure
INTEL CORP0 citations52
US10716231B2Jul 14, 2020
Pin count socket having reduced pin count and pattern transformation
INTEL CORP0 citations52
US12519049B2Jan 6, 2026
Liquid metal interconnect for modular system on an interconnect server architecture
INTEL CORP0 citations50
US12494435B2Dec 9, 2025
Liquid metal interconnect for modular system on an interposer server architecture
INTEL CORP0 citations50
US12009612B2Jun 11, 2024
Dual-sided socket device with corrugation structures and shield structures
INTEL CORP0 citations50
US11935860B2Mar 19, 2024
Electrical connector with insulated conductive layer
INTEL CORP0 citations50
US10044115B2Aug 7, 2018
Universal linear edge connector
INTEL CORP1 citations50
US11916322B2Feb 27, 2024
Dual-sided socket device with corrugation structures
INTEL CORP0 citations49
US9502800B2Nov 22, 2016
Double-mated edge finger connector
INTEL CORP0 citations41
US10636716B2Apr 28, 2020
Through-mold structures
INTEL CORP0 citations39