P

Inventor

NEKKANTY SRIKANT

US31 patents
⚠️ This page may combine multiple inventors who share the name “NEKKANTY SRIKANT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

29 patents
US10535615B2Jan 14, 2020

Electronic package that includes multi-layer stiffener

INTEL CORP2 citations72
US9692147B1Jun 27, 2017

Small form factor sockets and connectors

INTEL CORP5 citations72
US9953909B2Apr 24, 2018

Ball grid array (BGA) with anchoring pins

INTEL CORP2 citations70
US9780510B2Oct 3, 2017

Socket contact techniques and configurations

INTEL CORP3 citations70
US11808988B2Nov 7, 2023

Method and device for fast, passive alignment in photonics assembly

INTEL CORP2 citations68
US12523827B2Jan 13, 2026

Photonic integrated circuit to glass substrate alignment through dual cylindrical lens

INTEL CORP0 citations62
US11862547B2Jan 2, 2024

Differential crosstalk self-cancelation in stackable structures

INTEL CORP0 citations62
US11212932B2Dec 28, 2021

Pin count socket having reduced pin count and pattern transformation

INTEL CORP0 citations62
US12413001B2Sep 9, 2025

Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic package

INTEL CORP0 citations61
US12341281B2Jun 24, 2025

Micro socket electrical couplings for dies

INTEL CORP0 citations61
US10541494B2Jan 21, 2020

Connector for processor package

INTEL CORP1 citations61
US12506083B2Dec 23, 2025

Liquid metal interconnect for modular package server architecture

INTEL CORP0 citations60
US12153269B2Nov 26, 2024

Active optical coupler

INTEL CORP1 citations60
US10205292B2Feb 12, 2019

Socket contact techniques and configurations

INTEL CORP1 citations60
US12174436B2Dec 24, 2024

Package expanded beam connector for on-package optics

INTEL CORP0 citations59
US12493151B2Dec 9, 2025

Method and device for fast, passive alignment in photonics assembly

INTEL CORP0 citations57
US11830863B2Nov 28, 2023

Dual-sided co-packaged optics for high bandwidth networking applications

INTEL CORP0 citations56
US11217573B2Jan 4, 2022

Dual-sided co-packaged optics for high bandwidth networking applications

INTEL CORP0 citations56
US11569596B2Jan 31, 2023

Pressure features to alter the shape of a socket

INTEL CORP0 citations53
US12298572B2May 13, 2025

Device, method and system for optical communication with a photonic integrated circuit chip and a transverse oriented lens structure

INTEL CORP0 citations52
US10716231B2Jul 14, 2020

Pin count socket having reduced pin count and pattern transformation

INTEL CORP0 citations52
US12519049B2Jan 6, 2026

Liquid metal interconnect for modular system on an interconnect server architecture

INTEL CORP0 citations50
US12494435B2Dec 9, 2025

Liquid metal interconnect for modular system on an interposer server architecture

INTEL CORP0 citations50
US12009612B2Jun 11, 2024

Dual-sided socket device with corrugation structures and shield structures

INTEL CORP0 citations50
US11935860B2Mar 19, 2024

Electrical connector with insulated conductive layer

INTEL CORP0 citations50
US10044115B2Aug 7, 2018

Universal linear edge connector

INTEL CORP1 citations50
US11916322B2Feb 27, 2024

Dual-sided socket device with corrugation structures

INTEL CORP0 citations49
US9502800B2Nov 22, 2016

Double-mated edge finger connector

INTEL CORP0 citations41
US10636716B2Apr 28, 2020

Through-mold structures

INTEL CORP0 citations39

TRAN DONALD

1 patent

HEPPNER JOSHUA D

1 patent