Inventor
MORALES CHRISTOPHE
FR23 patents
⚠️ This page may combine multiple inventors who share the name “MORALES CHRISTOPHE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
COMMISSARIAT ENERGIE ATOMIQUE
19 patentsUS7232739B2Jun 19, 2007
Multifunctional metallic bonding
COMMISSARIAT ENERGIE ATOMIQUE24 citations92
US7781300B2Aug 24, 2010
Method for producing mixed stacked structures, different insulating areas and/or localised vertical electrical conducting areas
COMMISSARIAT ENERGIE ATOMIQUE14 citations84
US7541263B2Jun 2, 2009
Method for providing mixed stacked structures, with various insulating zones and/or electrically conducting zones vertically localized
COMMISSARIAT ENERGIE ATOMIQUE8 citations82
US7189632B2Mar 13, 2007
Multifunctional metallic bonding
COMMISSARIAT ENERGIE ATOMIQUE7 citations74
US9922954B2Mar 20, 2018
Method for performing direct bonding between two structures
COMMISSARIAT ENERGIE ATOMIQUE2 citations73
US9427948B2Aug 30, 2016
Manufacturing a flexible structure by transfers of layers
COMMISSARIAT ENERGIE ATOMIQUE4 citations72
US11081463B2Aug 3, 2021
Bonding method with electron-stimulated desorption
COMMISSARIAT ENERGIE ATOMIQUE0 citations62
US10497609B2Dec 3, 2019
Method for direct bonding of substrates including thinning of the edges of at least one of the two substrates
COMMISSARIAT ENERGIE ATOMIQUE1 citations62
US7476595B2Jan 13, 2009
Method for the molecular bonding of microelectronic components to a polymer film
COMMISSARIAT ENERGIE ATOMIQUE2 citations62
US7235461B2Jun 26, 2007
Method for bonding semiconductor structures together
COMMISSARIAT ENERGIE ATOMIQUE2 citations60
US9209068B2Dec 8, 2015
Method for the treatment and direct bonding of a material layer
COMMISSARIAT ENERGIE ATOMIQUE3 citations58
US10957539B2Mar 23, 2021
Method for bonding by direct adhesion
COMMISSARIAT ENERGIE ATOMIQUE0 citations57
US10651032B2May 12, 2020
Method for producing an epitaxial layer on a growth plate
COMMISSARIAT ENERGIE ATOMIQUE0 citations52
US8382933B2Feb 26, 2013
Molecular bonding method with cleaning with hydrofluoric acid in vapor phase and rinsing with deionized water
COMMISSARIAT ENERGIE ATOMIQUE0 citations50
US12532717B2Jan 20, 2026
Cationic elements-assisted direct bonding method
COMMISSARIAT ENERGIE ATOMIQUE0 citations47
US12577434B2Mar 17, 2026
Method for bonding two hydrophilic surfaces
COMMISSARIAT ENERGIE ATOMIQUE0 citations44
US10818500B2Oct 27, 2020
Method for wafer trimming
COMMISSARIAT ENERGIE ATOMIQUE0 citations41
US10755967B2Aug 25, 2020
Method for transferring a useful layer
COMMISSARIAT ENERGIE ATOMIQUE0 citations41
US10727106B2Jul 28, 2020
Method for transfer of a useful layer
COMMISSARIAT ENERGIE ATOMIQUE0 citations41