Inventor
TSAI WEI-WEN
US17 patents
⚠️ This page may combine multiple inventors who share the name “TSAI WEI-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC
14 patentsUS10604678B1Mar 31, 2020
Chemical mechanical polishing of tungsten using a method and composition containing quaternary phosphonium compounds
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC4 citations71
US9984895B1May 29, 2018
Chemical mechanical polishing method for tungsten
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC3 citations71
US10947415B2Mar 16, 2021
Chemical mechanical polishing of tungsten using a method and composition containing quaternary phosphonium compounds
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC0 citations61
US11339308B2May 24, 2022
Chemical mechanical polishing method
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC0 citations50
US10815392B2Oct 27, 2020
Chemical mechanical polishing method for tungsten
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC0 citations50
US10640682B2May 5, 2020
Chemical mechanical polishing method for tungsten
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC0 citations50
US10633558B2Apr 28, 2020
Chemical mechanical polishing method for tungsten
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC0 citations50
US10633557B2Apr 28, 2020
Chemical mechanical polishing method for tungsten
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC0 citations50
US10286518B2May 14, 2019
Chemical mechanical polishing method for tungsten
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC0 citations50
US12330261B2Jun 17, 2025
Offset pore poromeric polishing pad
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC0 citations45
US11667061B2Jun 6, 2023
Method of forming leveraged poromeric polishing pad
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC0 citations45
US10573524B2Feb 25, 2020
Method of chemical mechanical polishing a semiconductor substrate
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC0 citations41
US10557060B2Feb 11, 2020
Method of chemical mechanical polishing a substrate
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC0 citations40
US10181408B2Jan 15, 2019
Chemical mechanical polishing method for tungsten using polyglycols and polyglycol derivatives
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC0 citations40