Inventor
MIGNOT YANN A M
US33 patents
⚠️ This page may combine multiple inventors who share the name “MIGNOT YANN A M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
27 patentsUS9991156B2Jun 5, 2018
Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs
IBM15 citations93
US10586732B2Mar 10, 2020
Via cleaning to reduce resistance
IBM7 citations84
US10410875B2Sep 10, 2019
Alternating hardmasks for tight-pitch line formation
IBM4 citations84
US9779944B1Oct 3, 2017
Method and structure for cut material selection
IBM17 citations84
US9691659B1Jun 27, 2017
Via and chamfer control for advanced interconnects
IBM14 citations84
US9607886B1Mar 28, 2017
Self aligned conductive lines with relaxed overlay
IBM6 citations84
US10103022B2Oct 16, 2018
Alternating hardmasks for tight-pitch line formation
IBM8 citations83
US10090378B1Oct 2, 2018
Efficient metal-insulator-metal capacitor
IBM4 citations83
US10957583B2Mar 23, 2021
Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs
IBM1 citations73
US10546774B2Jan 28, 2020
Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs
IBM3 citations73
US10312103B2Jun 4, 2019
Alternating hardmasks for tight-pitch line formation
IBM1 citations73
US10032633B1Jul 24, 2018
Image transfer using EUV lithographic structure and double patterning process
IBM3 citations73
US9852946B1Dec 26, 2017
Self aligned conductive lines
IBM2 citations73
US9837351B1Dec 5, 2017
Avoiding gate metal via shorting to source or drain contacts
IBM3 citations73
US9786554B1Oct 10, 2017
Self aligned conductive lines
IBM5 citations73
US9773700B1Sep 26, 2017
Aligning conductive vias with trenches
IBM5 citations73
US10580652B2Mar 3, 2020
Alternating hardmasks for tight-pitch line formation
IBM2 citations72
US11557507B2Jan 17, 2023
Via cleaning to reduce resistance
IBM0 citations62
US10395985B2Aug 27, 2019
Self aligned conductive lines with relaxed overlay
IBM0 citations52
US10083864B2Sep 25, 2018
Self aligned conductive lines with relaxed overlay
IBM0 citations52
US10062605B2Aug 28, 2018
Via and chamfer control for advanced interconnects
IBM0 citations52
US10043744B2Aug 7, 2018
Avoiding gate metal via shorting to source or drain contacts
IBM1 citations52
US9972533B2May 15, 2018
Aligning conductive vias with trenches
IBM0 citations52
US9911647B2Mar 6, 2018
Self aligned conductive lines
IBM1 citations52
US10256289B2Apr 9, 2019
Efficient metal-insulator-metal capacitor fabrication
IBM0 citations51
US10354885B2Jul 16, 2019
Hard masks for block patterning
IBM0 citations50
US10090164B2Oct 2, 2018
Hard masks for block patterning
IBM0 citations50
TESSERA INC
4 patentsUS11031248B2Jun 8, 2021
Alternating hardmasks for tight-pitch line formation
TESSERA INC2 citations73
US10651266B2May 12, 2020
Efficient metal-insulator-metal capacitor
TESSERA INC1 citations72
US11171002B2Nov 9, 2021
Alternating hardmasks for tight-pitch line formation
TESSERA INC0 citations62
US10978550B2Apr 13, 2021
Efficient metal-insulator-metal capacitor
TESSERA INC0 citations62