Inventor

QUON ROGER A

US53 patents

⚠️ This page may combine multiple inventors who share the name “QUON ROGER A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

QUON ROGER A

IBM

Self aligned pattern formation post spacer etchback in tight pitch configurations

Stacked planar capacitors with scaled EOT

Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs

Surface nitridation in metal interconnects

Selective surface modification of interconnect structures

Self aligned pattern formation post spacer etchback in tight pitch configurations

Method and structure for cut material selection

Self aligned conductive lines with relaxed overlay

Structure and method for hybrid tungsten copper metal contact

Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer

Nitridization for semiconductor structures

Low stress conductive polymer bump

Interconnect structure

Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs

Back end of line integration for interconnects

Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs

Interconnect structure

Self aligned pattern formation post spacer etchback in tight pitch configurations

Self aligned conductive lines

Self aligned conductive lines

Aligning conductive vias with trenches

I/C chip suitable for wire bonding

Low stress conductive polymer bump

BLM structure for application to copper pad

Method for forming robust solder interconnect structures by reducing effects of seed layer underetching

Barrier for interconnect and method

Variable fill and cheese for mitigation of BEOL topography

Interconnect structures comprising capping layers with low dielectric constants and methods of making the same

Surface nitridation in metal interconnects

Modulating the microstructure of metallic interconnect structures

Self aligned conductive lines with relaxed overlay

Selective surface modification of interconnect structures

Surface nitridation in metal interconnects

Nitridization for semiconductor structures

Modulating the microstructure of metallic interconnect structures

Self aligned conductive lines with relaxed overlay

Surface nitridation in metal interconnects

Aligning conductive vias with trenches

Interconnect structure

Self aligned conductive lines

GLOBALFOUNDRIES INC

Integrated circuit structure with metal crack stop and methods of forming same

Integrated circuit structure with crack stop and method of forming same

Subsurface wires of integrated chip and methods of forming

CLEVENGER LAWRENCE A

Electrically contactable grids manufacture

Self-aligned nano-scale device with parallel plate electrodes

Self-aligned nano-scale device with parallel plate electrodes

TESSERA LLC

Self aligned pattern formation post spacer etchback in tight pitch configurations

Self aligned pattern formation post spacer etchback in tight pitch configurations

TESSERA INC

Self aligned pattern formation post spacer etchback in tight pitch configurations

SAMSUNG ELECTRONICS CO LTD

Metallic synapses for neuromorphic and evolvable hardware