Inventor
KIM MOON IL
KR23 patents
⚠️ This page may combine multiple inventors who share the name “KIM MOON IL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
14 patentsUS9853003B1Dec 26, 2017
Fan-out semiconductor package
SAMSUNG ELECTRO MECH31 citations93
US7947906B2May 24, 2011
Printed circuit board and manufacturing method thereof
SAMSUNG ELECTRO MECH19 citations92
US7697301B2Apr 13, 2010
Printed circuit board having embedded electronic components and manufacturing method thereof
SAMSUNG ELECTRO MECH21 citations92
US10811328B1Oct 20, 2020
Semiconductor package
SAMSUNG ELECTRO MECH4 citations73
US10304791B2May 28, 2019
Electronic component package
SAMSUNG ELECTRO MECH2 citations73
US10020272B2Jul 10, 2018
Electronic component package
SAMSUNG ELECTRO MECH2 citations73
US9543076B2Jan 10, 2017
Electronic component and method of manufacturing the same
SAMSUNG ELECTRO MECH2 citations73
US10177100B2Jan 8, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH2 citations71
US10347613B1Jul 9, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH1 citations62
US8011086B2Sep 6, 2011
Method of manufacturing a component-embedded printed circuit board
SAMSUNG ELECTRO MECH2 citations61
US11462498B2Oct 4, 2022
Semiconductor package including frame in which semiconductor chip is embedded
SAMSUNG ELECTRO MECH0 citations52
US11037880B2Jun 15, 2021
Semiconductor package and antenna module including the same
SAMSUNG ELECTRO MECH0 citations51
US9357646B2May 31, 2016
Package substrate
SAMSUNG ELECTRO MECH1 citations51
US9386701B2Jul 5, 2016
Electronic component embedded printed circuit board
SAMSUNG ELECTRO MECH0 citations45
SAMSUNG ELECTRONICS CO LTD
4 patentsUS11842956B2Dec 12, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11075152B2Jul 27, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US10734335B2Aug 4, 2020
Electronic component package
SAMSUNG ELECTRONICS CO LTD0 citations52
US10818604B2Oct 27, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations42