Inventor
WASSERMAN MATTHEW B
US23 patents
⚠️ This page may combine multiple inventors who share the name “WASSERMAN MATTHEW B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KULICKE & SOFFA IND INC
22 patentsUS9576928B2Feb 21, 2017
Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same
KULICKE & SOFFA IND INC7 citations83
US9425162B2Aug 23, 2016
Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
KULICKE & SOFFA IND INC5 citations82
US9093549B2Jul 28, 2015
Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
KULICKE & SOFFA IND INC8 citations82
US9136243B2Sep 15, 2015
Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
KULICKE & SOFFA IND INC6 citations80
US9478516B2Oct 25, 2016
Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
KULICKE & SOFFA IND INC4 citations72
US10468373B2Nov 5, 2019
Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
KULICKE & SOFFA IND INC4 citations66
US12431459B2Sep 30, 2025
Methods of monitoring gas byproducts of a bonding system, and related monitoring systems and bonding systems
KULICKE & SOFFA IND INC0 citations62
US11031367B2Jun 8, 2021
Bond head assemblies including reflective optical elements, related bonding machines, and related methods
KULICKE & SOFFA IND INC0 citations62
US9847314B2Dec 19, 2017
Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
KULICKE & SOFFA IND INC1 citations61
US9165902B2Oct 20, 2015
Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
KULICKE & SOFFA IND INC2 citations61
US12381175B2Aug 5, 2025
Bonding systems, and methods of providing a reducing gas on a bonding system
KULICKE & SOFFA IND INC0 citations60
US12062636B2Aug 13, 2024
Bonding systems, and methods of providing a reducing gas on a bonding system
KULICKE & SOFFA IND INC0 citations60
US9425163B2Aug 23, 2016
Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
KULICKE & SOFFA IND INC2 citations59
US12500204B2Dec 16, 2025
Bonding systems for bonding of semiconductor elements to substrates including a gas composition analyzer, and related methods
KULICKE & SOFFA IND INC0 citations55
US11011493B2May 18, 2021
Bonding and placement tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
KULICKE & SOFFA IND INC0 citations55
US11342301B2May 24, 2022
Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
KULICKE & SOFFA IND INC0 citations51
US11049839B2Jun 29, 2021
Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
KULICKE & SOFFA IND INC0 citations51
US9997383B2Jun 12, 2018
Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same
KULICKE & SOFFA IND INC1 citations51
US9780066B2Oct 3, 2017
Thermocompression bonding systems and methods of operating the same
KULICKE & SOFFA IND INC1 citations51
US9731378B2Aug 15, 2017
Thermocompression bonders, methods of operating thermocompression bonders, and horizontal correction motions using lateral force measurement in thermocompression bonding
KULICKE & SOFFA IND INC0 citations51
US9659902B2May 23, 2017
Thermocompression bonding systems and methods of operating the same
KULICKE & SOFFA IND INC1 citations51
US9929121B2Mar 27, 2018
Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
KULICKE & SOFFA IND INC1 citations50