Inventor
MAEKAWA KAZUYOSHI
JP40 patents
⚠️ This page may combine multiple inventors who share the name “MAEKAWA KAZUYOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS ELECTRONICS CORP
16 patentsUS9972505B2May 15, 2018
Semiconductor device and its manufacturing method
RENESAS ELECTRONICS CORP11 citations84
US9406628B2Aug 2, 2016
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP7 citations84
US9508646B2Nov 29, 2016
Semicondutor device with copper plugs having different resistance values
RENESAS ELECTRONICS CORP6 citations83
US10204853B2Feb 12, 2019
Semiconductor device
RENESAS ELECTRONICS CORP3 citations73
US10192755B2Jan 29, 2019
Semiconductor device and its manufacturing method
RENESAS ELECTRONICS CORP5 citations73
US9530819B2Dec 27, 2016
Manufacturing method of semiconductor integrated circuit device
RENESAS ELECTRONICS CORP3 citations73
US8749064B2Jun 10, 2014
Semiconductor device with a line and method of fabrication thereof
RENESAS ELECTRONICS CORP4 citations73
US11450561B2Sep 20, 2022
Semiconductor device with copper interconnections
RENESAS ELECTRONICS CORP2 citations72
US10665502B2May 26, 2020
Semiconductor device with an interconnection layer and method of manufacturing the same
RENESAS ELECTRONICS CORP2 citations72
US10083924B2Sep 25, 2018
Semiconductor device and manufacturing method thereof
RENESAS ELECTRONICS CORP3 citations72
US7936069B2May 3, 2011
Semiconductor device with a line and method of fabrication thereof
RENESAS ELECTRONICS CORP3 citations63
US12080591B2Sep 3, 2024
Semiconductor device having interconnection structure and method of manufacturing the same
RENESAS ELECTRONICS CORP0 citations62
US9607956B2Mar 28, 2017
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP0 citations52
US9608034B2Mar 28, 2017
Manufacturing method of back illumination CMOS image sensor device using wafer bonding
RENESAS ELECTRONICS CORP1 citations52
US9263497B2Feb 16, 2016
Manufacturing method of back illumination CMOS image sensor device using wafer bonding
RENESAS ELECTRONICS CORP0 citations52
US9972530B2May 15, 2018
Method of manufacturing semiconductor device including copper interconnections
RENESAS ELECTRONICS CORP0 citations51
MITSUBISHI ELECTRIC CORP
9 patentsUS5565708AOct 15, 1996
Semiconductor device comprising composite barrier layer
MITSUBISHI ELECTRIC CORP107 citations97
US6329284B2Dec 11, 2001
Manufacturing process of a semiconductor device
MITSUBISHI ELECTRIC CORP31 citations92
US6171957B1Jan 9, 2001
Manufacturing method of semiconductor device having high pressure reflow process
MITSUBISHI ELECTRIC CORP35 citations92
US6002175ADec 14, 1999
Semiconductor device with improved connection hole for embedding an electrically conductive layer portion
MITSUBISHI ELECTRIC CORP31 citations92
US5475267ADec 12, 1995
Multilayer interconnection structure for a semiconductor device
MITSUBISHI ELECTRIC CORP29 citations92
US5313100AMay 17, 1994
Multilayer interconnection structure for a semiconductor device
MITSUBISHI ELECTRIC CORP37 citations92
US6333259B1Dec 25, 2001
Semiconductor device and apparatus and method for manufacturing the same
MITSUBISHI ELECTRIC CORP8 citations73
US5712140AJan 27, 1998
Method of manufacturing interconnection structure of a semiconductor device
MITSUBISHI ELECTRIC CORP4 citations62
US6599820B1Jul 29, 2003
Method of producing a semiconductor device
MITSUBISHI ELECTRIC CORP5 citations59
RENESAS TECH CORP
9 patentsUS7192871B2Mar 20, 2007
Semiconductor device with a line and method of fabrication thereof
RENESAS TECH CORP18 citations93
US6864183B2Mar 8, 2005
Method for manufacturing a semiconductor device
RENESAS TECH CORP15 citations84
US7709955B2May 4, 2010
Semiconductor device with a line and method of fabrication thereof
RENESAS TECH CORP4 citations74
US7709388B2May 4, 2010
Semiconductor device with a line and method of fabrication thereof
RENESAS TECH CORP1 citations63
US7538030B2May 26, 2009
Semiconductor device and method of manufacturing same
RENESAS TECH CORP1 citations63
US7371681B2May 13, 2008
Method of manufacturing a semiconductor device
RENESAS TECH CORP2 citations63
US6975007B2Dec 13, 2005
Semiconductor device including a polysilicon, barrier structure, and tungsten layer electrode
RENESAS TECH CORP1 citations63
US6657301B2Dec 2, 2003
Contact structure, method of forming the same, semiconductor device, and method of manufacturing the same
RENESAS TECH CORP4 citations58
US7479446B2Jan 20, 2009
Semiconductor device and method of manufacturing same
RENESAS TECH CORP0 citations52
MAEKAWA KAZUYOSHI
3 patentsUS8432037B2Apr 30, 2013
Semiconductor device with a line and method of fabrication thereof
MAEKAWA KAZUYOSHI21 citations91
US8125085B2Feb 28, 2012
Semiconductor device having wiring with oxide layer of impurity from the wiring
MAEKAWA KAZUYOSHI11 citations82
US8222146B2Jul 17, 2012
Semiconductor device with a line and method of fabrication thereof
MAEKAWA KAZUYOSHI0 citations51